sensitivity and that, using optically coupled MOSFET
technology, provides 3750V
rms
of input to output
isolation.
Its optically coupled outputs, which use the patented
OptoMOS architecture, are controlled by a highly
efficient GaAIAs infrared LED.
Useful as a replacement for mechanical relays, the
XCA170 offers the superior reliability associated with
semiconductor devices. Because it has no moving
parts, it offers faster, bounce-free switching in a more
compact surface mount or through hole package.
XCA170
Features
•
3750V
rms
Input/Output Isolation
•
Low Drive Power Requirements (TTL/CMOS
Compatible)
•
High Reliability
•
Arc-Free With No Snubbing Circuits
•
FCC Compatible
•
VDE Compatible
•
No EMI/RFI Generation
•
Small 6-Pin Package
•
Machine Insertable, Wave Solderable
•
Surface Mount Tape & Reel Version Available
Approvals
•
UL Recognized Component: File E76270
•
CSA Certified Component: Certificate 1175739
•
EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 004
Applications
•
Telecommunications
•
Telecom Switching
•
Tip/Ring Circuits
•
Modem Switching (Laptop, Notebook,
Pocket Size)
•
Hook Switch
•
Dial Pulsing
•
Ground Start
•
Ringing Injection
•
Instrumentation
•
Multiplexers
•
Data Acquisition
•
Electronic Switching
•
I/O Subsystems
•
Meters (Watt-Hour, Water, Gas)
•
Medical Equipment—Patient/Equipment Isolation
•
Security
•
Aerospace
•
Industrial Controls
Ordering Information
Part #
XCA170
XCA170S
XCA170STR
Description
6-Pin DIP (50/Tube)
6-Pin Surface Mount (50/Tube)
6-Pin Surface Mount (1,000/Reel)
Pin Configuration
AC/DC Configuration
+ Control
– Control
Do Not Use
1
2
3
6
5
4
Load
Do Not Use
Load
DC Only Configuration
+ Control
– Control
Do Not Use
1
2
3
6
5
4
+ Load
– Load
Switching Characteristics
of Normally Open Devices
Form-A
I
F
90%
I
LOAD
10%
t
on
t
off
Pb
DS-XCA170-R04
e
3
www.ixysic.com
1
I
NTEGRATED
C
IRCUITS
D
IVISION
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
1
Total Power Dissipation
2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
2
XCA170
Ratings
350
5
50
1
150
800
3750
-40 to +85
-40 to +125
Units
V
P
V
mA
A
mW
mW
V
rms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Derate linearly 1.33 mW / ºC
Derate linearly 6.67 mW / ºC
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current
AC/DC Configuration, Continuous
DC Configuration, Continuous
Peak
On-Resistance
1
AC/DC Configuration
DC Configuration
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Capacitance, Input to Output
1
Conditions
Symbol
Min
Typ
Max
Units
-
-
t=10ms
I
L
=120mA
I
L
=200mA
V
L
=350V
P
I
L
I
LPK
-
-
-
-
-
-
-
-
-
-
0.4
0.9
-
-
-
-
-
31
10
-
-
-
25
-
0.7
1.2
-
3
100
180
±350
50
15
1
5
5
-
5
-
1.4
10
-
mA
rms
/ mA
DC
mA
DC
mA
P
µA
ms
ms
pF
mA
mA
V
µA
pF
R
ON
I
LEAK
t
on
t
off
C
OUT
I
F
I
F
V
F
I
R
C
I/O
I
F
= 5mA, V
L
= 10V
V
L
=50V, f=1MHz
I
L
= 120mA
-
I
F
= 5mA
V
R
= 5V
-
Measurement taken within 1 second of on-time.
2
www.ixysic.com
R04
I
NTEGRATED
C
IRCUITS
D
IVISION
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Typical LED Forward Voltage Drop
(N=50, I
F
=5mA)
35
30
Device Count (N)
25
20
15
10
5
0
1.17
1.19
1.21
1.23
1.25
LED Forward Voltage Drop (V)
Device Count (N)
25
20
15
10
5
0
0.67
0.75
0.83
0.91
0.99
1.06
1.14
Turn-On Time (ms)
XCA170
Typical Turn-On Time
(N=50, I
L
=100mA
DC
)
Typical Turn-Off Time
(N=50, I
L
=100mA
DC
)
25
20
15
10
5
0
0.11
0.14
0.17
0.19
0.22
0.25
0.28
Turn-Off Time (ms)
Typical I
F
for Switch Operation
(N=50, I
L
=100mA
DC
)
25
20
15
10
5
0
0.44
0.50
0.56
0.62
0.69
0.75
0.81
LED Current (mA)
25
20
15
10
5
0
Typical I
F
for Switch Dropout
(N=50, I
L
=100mA
DC
)
25
20
15
10
5
0
0.44
0.50
0.56
0.62
0.69
0.75
0.81
Device Count (N)
Typical On-Resistance Distribution
(N=50, I
L
=100mA
DC
)
Device Count (N)
Device Count (N)
Device Count (N)
29.09 29.86 30.63 31.40 32.16 32.93 33.70
On-Resistance ( )
LED Current (mA)
Typical Blocking Voltage Distribution
(N=50)
25
20
15
10
5
0
424.0 429.3 434.5 439.7 444.9 450.1 455.4
Blocking Voltage (V
P
)
Device Count (N)
Typical LED Forward Voltage Drop
vs. Temperature
LED Forward Voltage Drop (V)
1.8
Turn-On Time (ms)
1.6
1.4
1.2
1.0
0.8
-40
-20
0
20
40
60
80
100
120
Temperature (ºC)
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
0
5
Typical Turn-On Time
vs. LED Forward Current
(I
L
=100mA
DC
)
I
F
=50mA
I
F
=30mA
I
F
=20mA
I
F
=10mA
I
F
=5mA
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
5
Typical Turn-Off Time
vs. LED Forward Current
(I
L
=100mA
DC
)
10
15
20
25
30
35
40
45
50
Turn-Off Time (ms)
10
15
20
25
30
35
40
45
50
LED Forward Current (mA)
LED Forward Current (mA)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
R04
www.ixysic.com
3
I
NTEGRATED
C
IRCUITS
D
IVISION
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Typical Turn-On Time
vs. Temperature
(I
L
=100mA
DC
)
I
F
=5mA
Turn-Off Time (ms)
XCA170
1.8
1.6
Turn-On Time (ms)
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
-40
-20
I
F
=10mA
I
F
=20mA
0
20
40
60
80
100 120
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
-40
Typical Turn-Off Time
vs. Temperature
(I
L
=100mA
DC
)
70
60
On-Resistance ( )
50
40
30
20
10
0
Typical On-Resistance
vs. Temperature
(I
F
=2mA, I
L
=100mA
DC
)
-20
0
20
40
60
80
100
120
-40
-20
0
20
40
60
80
100 120
Temperature (ºC)
Temperature (ºC)
Temperature (ºC)
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=100mA
DC
)
6
5
LED Current (mA)
4
3
2
1
0
-40
-20
0
20
40
60
80
100 120
Temperature (ºC)
LED Current (mA)
6
5
4
3
2
1
0
-40
Typical I
F
for Switch Dropout
vs. Temperature
(I
L
=100mA
DC
)
Typical Load Current
vs. Load Voltage
(I
F
=5mA)
120
100
80
60
40
20
0
-20
-40
-60
-80
-100
-120
Load Current (mA)
-20
0
20
40
60
80
100 120
-4
-3
-2
-1
0
1
2
3
4
Temperature (ºC)
Load Voltage (V)
Maximum Load Current
vs. Temperature
160
140
120
100
80
60
40
20
0
-40
-20
0
20
40
60
80
100
120
Temperature (ºC)
I
F
=10mA
I
F
=5mA
I
F
=2mA
Blocking Voltage (V
P
)
Load Current (mA)
455
450
Typical Blocking Voltage
vs. Temperature
0.016
0.014
Leakage ( A)
0.012
0.010
0.008
0.006
0.004
0.002
-40
-20
0
20
40
60
80
100
0
-40
Typical Leakage vs. Temperature
Measured Across Pins 4&6
445
440
435
430
425
420
Temperature (ºC)
-20
0
20
40
60
80
100
Temperature (ºC)
Energy Rating Curve
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
10 s 100 s 1ms 10ms 100ms
Time
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
Load Current (A)
1s
10s
100s
4
www.ixysic.com
R04
I
NTEGRATED
C
IRCUITS
D
IVISION
Manufacturing Information
Moisture Sensitivity
XCA170
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
XCA170 / XCA170S
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device
XCA170 / XCA170S
Maximum Temperature x Time
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
https://gitee.com/KiCAD-CN/kicad-cn-forum/blob/master/zh_CN/KiCad_plugin.md#kicostKiCost
KiCost is designed to be run as a script to generate a part cost spreadsheet for a circuit board developed with...
Through the Zhouyi AIPU deployment and simulation tutorial , everyone should have completed the simulation and execution of the model using the simulator on the PC. This tutorial will lead you to run ...
Angle, distance, speed, and motion direction detection can be done on one board. Infineon's FMCW radar solution Position2Go is here!
It uses a new RF transceiver and main control MCU, which improves p...
I played around with PWM.The PWM leg is P2.4代码：
#include ti/devices/msp432p4xx/driverlib/driverlib.h
uint8_t TXData = 1;
uint8_t RXData = 0;
//![Simple Timer_A Config]
/* Timer_A PWM Configuration Par...
I want to use ESP32 to play MP3. I already have an IIS amplifier board and an SPI TF card plug-in. I want to play music, but it can only play WAV. Can I ask the experts how to soft-decode MP3 and then...
50000000. This is the sales figure of the domestic mobile phone brand realme since its establishment more than two years ago. According to the latest data report from Counterpoint, realme shipped 1...[Details]
1. Differences in structure The pixels of the passive drive matrix are composed of a simple substrate with a cathode and an anode. The intersection of the anode and the cathode can emit light, and t...[Details]
introduction
With the development of economy and the progress of science and technology, the application of automatic control system in industrial production is becoming more and more extensiv...[Details]
BLDC Motor Control Algorithm
Brushless motors are self-commutated (self-direction switching) and therefore more complex to control. BLDC motor control requires knowledge of the rotor position ...[Details]
1. Overview
S3C6410 provides 4 independent asynchronous serial ports, each of which can work in interrupt mode or DMA mode. That is, the UART can generate an interrupt or DMA request. The UART c...[Details]
Lenovo Group today announced its first fiscal quarter results ending June 30, 2019: quarterly revenue of US$12.512 billion (approximately RMB 85.3 billion), a year-on-year increase of 5%; net profit ...[Details]
New energy storage is a key link in the development of new energy and a key technology to support new power systems. At present, the large-scale application of new energy storage in my country is show...[Details]
Introduction: A year ago, I started using TI's x14x series ultra-low power single-chip MSP430F149. I felt that compared with the ordinary 51 series, the functions of each peripheral were more powerful...[Details]
0 Introduction
Sensor circuits are usually used to measure weak signals and have high sensitivity, but they are also easy to receive some irregular noise or interference signals from the outsid...[Details]
DDS (Direct Digital Synthesizer) DDS is the abbreviation of direct digital frequency synthesizer. In addition to the most basic frequency synthesis function, direct digital synthesizer is also a flex...[Details]
The smart cockpit is the most similar part between current cars and consumer electronics, such as mobile phones, and is also a very important tool for Internet IT giants to enter the field of smart c...[Details]
In recent years, due to the advancement of technology and efficiency, the application of LED has become more and more extensive; with the upgrading of LED applications, the market demand for LED has ...[Details]
Source:Getty Images/fizkes
Baidu, a self-driving taxi service provider, has selected Hesai Technology as the exclusive long-range LiDAR supplier for its Yichi 06 self-driving tax...[Details]
Copper indium gallium selenide (CIGS) thin film solar cells are a new type of photovoltaic cell product that has attracted much attention due to their high efficiency, no decay, radiation resistanc...[Details]
Figure thyristor bypass arc extinguishing principle diagram
Ion nitriding equipment with relatively high power (above 100kW) usually adopts thyristor bypass arc extinguishing, and its circuit is...[Details]
DIY/Open Source Hardware
京公网安备 11010802033920号
EEWORLD
