EEWORLDEEWORLDEEWORLD

Part Number

Search
 PDF

381LQ102M200K022

Description
Aluminum Electrolytic Capacitors - Snap In 200Volts 1000uF 30X30
CategoryPassive components   
ManufacturerCornell Dubilier
Download Datasheet Parametric View All

381LQ102M200K022 Online Shopping

Suppliers Part Number Price MOQ In stock  
381LQ102M200K022 - - View Buy Now

381LQ102M200K022 Overview

Aluminum Electrolytic Capacitors - Snap In 200Volts 1000uF 30X30

381LQ102M200K022 Parametric

Parameter NameAttribute value
Product CategoryAluminum Electrolytic Capacitors - Snap In
ManufacturerCornell Dubilier
RoHSDetails
Capacitance1000 uF
Voltage Rating DC200 VDC
Tolerance20 %
ESR199 mOhms
Minimum Operating Temperature- 40 C
Maximum Operating Temperature+ 105 C
Number of Pins2
Diameter30 mm
Length30 mm
Lead Spacing10 mm
Life2000 Hour
Ripple Current2.3 A
PackagingTray
Dissipation Factor DF-
Height-
Leakage Current-
ProductAluminum Electrolytic Capacitors
Factory Pack Quantity80
Termination StyleSnap In
Test Frequency120 Hz
TypeHigh Ripple Snap Mount Capacitors
Unit Weight1.234589 oz
DM8168 DSP and ARM add library and call
[color=#000]Call the elf format lib library in DSP[/color] [backcolor=white][color=#000000]Note: the lib library must be in elf format. CCS5.2 can be used to compile the elf format lib library. For de...
Jacktang DSP and ARM Processors
(A-Current Signal Detection Device) Tianjin First Prize_Topic A
[size=6][font=微软雅黑, "]Abstract: [/font][/size][p=30, 2, left][font=微软雅黑, "][size=14px]This current signal detection device can amplify the signal generated by the arbitrary waveform signal generator u...
sigma Electronics Design Contest
CH549EVT development board test - unpacking and development platform establishment
First of all, I would like to thank Qinheng Electronics and EEWORLD for providing this review opportunity!1. UnboxingThe picture below is the CH549EVT-L development board evaluated in this review, whi...
hujj MCU
How to use PCB layer stacking to control EMI radiation [Transfer]
There are many ways to solve the EMI problem. Modern EMI suppression methods include: using EMI suppression coatings, selecting appropriate EMI suppression components and EMI simulation design. This a...
eric_wang PCB Design
EEWORLD University ---- Intel SoC FPGA Development and Application Training Course by Xiaomei
Intel SoC FPGA Development and Application Training Course by Xiaomei : https://training.eeworld.com.cn/course/5037What is SoC FPGA, what are its advantages, and how to use SoC FPGA for development? I...
抛砖引玉 Talking
LSM6DSL free fall detection STM32L4R5
使用STMems_Standard_C_drivers库 程序参考了STM32CubeExpansion MEMS-XT1的LSM6DSL_FreeFallDetection[code]void lsm6dsl_free_fall_detection(void) {/**Initialize mems driver interface*/dev_ctx.write_reg = platform_w...
littleshrimp MEMS sensors

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号