Flash Memory 2.7 to 3.6V 8Mbit Multi-Purpose Flash
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | Microchip |
Parts packaging code | BGA |
package instruction | 6 X 8 MM, 0.80 MM PITCH, ROHS COMPLIANT, MO-210AB1,TFBGA-48 |
Contacts | 48 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Factory Lead Time | 7 weeks |
Maximum access time | 70 ns |
Other features | BOTTOM BOOT BLOCK |
startup block | BOTTOM |
command user interface | YES |
Universal Flash Interface | YES |
Data polling | YES |
JESD-30 code | R-PBGA-B48 |
JESD-609 code | e1 |
length | 8 mm |
memory density | 8388608 bit |
Memory IC Type | FLASH |
memory width | 16 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of departments/size | 256 |
Number of terminals | 48 |
word count | 524288 words |
character code | 512000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 512KX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | TFBGA |
Encapsulate equivalent code | BGA48,6X8,32 |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, THIN PROFILE, FINE PITCH |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 3/3.3 V |
Programming voltage | 2.7 V |
Certification status | Not Qualified |
ready/busy | YES |
Maximum seat height | 1.2 mm |
Department size | 2K |
Maximum standby current | 0.00002 A |
Maximum slew rate | 0.03 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 2.7 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 40 |
switch bit | YES |
type | NOR TYPE |
width | 6 mm |