MC68EC030FE40C datasheet, PDF - EEWORLD Datasheet

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MC68EC030FE40C: DescriptionMicroprocessors - MPU 32B ON-CHIP CACHE; CategoryThe embedded processor and controller Microcontrollers and processors; File Size553KB，19 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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MC68EC030FE40C Overview

Microprocessors - MPU 32B ON-CHIP CACHE

MC68EC030FE40C Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	QFP
package instruction	QFP,
Contacts	132
Reach Compliance Code	unknown
ECCN code	3A991
Other features	DYNAMIC BUS SIZING;UPTO 9.2 MIPS
Address bus width	32
bit size	32
boundary scan	NO
maximum clock frequency	40 MHz
External data bus width	32
Format	FIXED POINT
Integrated cache	YES
JESD-30 code	S-CQFP-G132
JESD-609 code	e3
length	24.13 mm
low power mode	NO
Humidity sensitivity level	1
Number of terminals	132
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QFP
Package shape	SQUARE
Package form	FLATPACK
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum seat height	3.175 mm
speed	40 MHz
Maximum supply voltage	5.25 V
Minimum supply voltage	4.75 V
Nominal supply voltage	5 V
surface mount	YES
technology	HCMOS
Temperature level	COMMERCIAL
Terminal surface	Matte Tin (Sn)
Terminal form	GULL WING
Terminal pitch	0.635 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	40
width	24.13 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR

MC68EC030FE40C Related Products

	MC68EC030FE40C	MC68030FE25C	MC68030RC16C	MC68030FE16C	MC68030RC40C	MC68030FE20C	MC68EC030FE25CB1
Description	Microprocessors - MPU 32B ON-CHIP CACHE		Microprocessors - MPU 32B ON-CHIP CACHE MMU	Microprocessors - MPU 32B ON-CHIP CACHE MMU	Microprocessors - MPU 32B ON-CHIP CACHE MMU	Microprocessors - MPU 32B ON-CHIP CACHE MMU	IC MPU M680X0 25MHZ 132CQFP
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Maker	NXP	NXP	NXP	NXP	NXP	NXP	NXP
Parts packaging code	QFP	QFP	PGA	QFP	PGA	QFP	QFP
package instruction	QFP,	QFP, QFP132,1.2SQ	LEAD FREE, PGA-128	QFP,	LEAD FREE, PGA-128	QFP, QFP132,1.2SQ	QFP,
Contacts	132	132	128	132	128	132	132
Reach Compliance Code	unknown	compliant	unknown	unknown	unknown	compliant	compliant
ECCN code	3A991	3A991	EAR99	3A991	EAR99	3A991	EAR99
Address bus width	32	32	32	32	32	32	32
bit size	32	32	32	32	32	32	32
boundary scan	NO	NO	NO	NO	NO	NO	NO
maximum clock frequency	40 MHz	25 MHz	16 MHz	16 MHz	40 MHz	20 MHz	25 MHz
External data bus width	32	32	32	32	32	32	32
Format	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT
Integrated cache	YES	YES	YES	YES	YES	YES	YES
JESD-30 code	S-CQFP-G132	S-CQFP-G132	S-CPGA-P128	S-CQFP-G132	S-CPGA-P128	S-CQFP-G132	S-CQFP-G132
length	24.13 mm	24.13 mm	34.545 mm	24.13 mm	34.545 mm	24.13 mm	24.13 mm
low power mode	NO	NO	NO	NO	NO	NO	NO
Number of terminals	132	132	128	132	128	132	132
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QFP	QFP	PGA	QFP	PGA	QFP	QFP
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK	FLATPACK	GRID ARRAY	FLATPACK	GRID ARRAY	FLATPACK	FLATPACK
Peak Reflow Temperature (Celsius)	260	260	NOT SPECIFIED	260	NOT SPECIFIED	260	260
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	3.175 mm	3.175 mm	4.7 mm	3.175 mm	4.7 mm	3.175 mm	3.175 mm
speed	40 MHz	25 MHz	16 MHz	16 MHz	40 MHz	20 MHz	25 MHz
Maximum supply voltage	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V
Minimum supply voltage	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	NO	YES	NO	YES	YES
technology	HCMOS	HCMOS	HCMOS	HCMOS	HCMOS	HCMOS	HCMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	GULL WING	GULL WING	PIN/PEG	GULL WING	PIN/PEG	GULL WING	GULL WING
Terminal pitch	0.635 mm	0.635 mm	2.54 mm	0.635 mm	2.54 mm	0.635 mm	0.635 mm
Terminal location	QUAD	QUAD	PERPENDICULAR	QUAD	PERPENDICULAR	QUAD	QUAD
Maximum time at peak reflow temperature	40	40	NOT SPECIFIED	40	NOT SPECIFIED	40	NOT SPECIFIED
width	24.13 mm	24.13 mm	34.545 mm	24.13 mm	34.545 mm	24.13 mm	24.13 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR
JESD-609 code	e3	e3	-	e3	-	e3	e3
Humidity sensitivity level	1	1	-	1	-	1	1
Terminal surface	Matte Tin (Sn)	Matte Tin (Sn)	-	Matte Tin (Sn)	-	Matte Tin (Sn)	Matte Tin (Sn)

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