This document was generated on 11/28/2017
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
Overview:
Description:
0737801136
Active
HDM® Backplane Connector System
HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 144 Circuits,
Mounted Height 16.00mm, Pin Length 2.50mm, Solder Tail
Documents:
3D Model
Drawing (PDF)
Agency Certification
UL
General
Product Family
Series
Application
Comments
Component Type
Overview
Product Name
UPC
Physical
Circuits (Loaded)
Circuits (maximum)
Color - Resin
Durability (mating cycles max)
First Mate / Last Break
Flammability
Guide to Mating Part
Keying to Mating Part
Material - Metal
Material - Plating Mating
Material - Plating Termination
Material - Resin
Net Weight
Number of Columns
Number of Pairs
Number of Rows
Orientation
PC Tail Length
PCB Locator
PCB Retention
PCB Thickness - Recommended
Packaging Type
Pitch - Mating Interface
Pitch - Termination Interface
Plating min - Mating
Plating min - Termination
Polarized to PCB
Stackable
Surface Mount Compatible (SMC)
Temperature Range - Operating
Termination Interface: Style
Electrical
Product Specification PS-73780-999-001 (PDF)
RoHS Certificate of Compliance (PDF)
Series image - Reference only
E29179
Backplane Connectors
73780
Daughtercard, Mezzanine
Solder Tail
PCB Receptacle
HDM® Backplane Connector System
HDM
800753003569
144
144
Black
250
No
94V-0
No
None
Copper-Nickel-Tin
Gold
Tin
High Temperature Thermoplastic
20.030/g
24
Open Pin Field
6
Vertical
2.50mm
No
None
1.60mm
Tube
2.00mm
2.00mm
0.762µm
2.540µm
No
Yes
Yes
-55°C to +105°C
Through Hole
EU ELV
Not Relevant
EU RoHS
China RoHS
Compliant
REACH SVHC
Not Contained Per -
ED/30/2017 (7 July
2017)
Halogen-Free
Status
Low-Halogen
Need more information on product
environmental compliance?
Email productcompliance@molex.com
Please visit the Contact Us section for any
non-product compliance questions.
China ROHS
ELV
RoHS Phthalates
Green Image
Not Relevant
Not Contained
Search Parts in this Series
73780 Series
Mates With
HDM Board-to-Board Backplane Header
73642 , 73643 , 73644 , 73942 , 73943 ,
73944 , 7 4349, 74428. HDM Board-to-
Board Stacking Header 73769 , 73770 ,
73782 , 73783 , 73771
Current - Maximum per Contact
Data Rate
Real Signals (per 25mm)
Shielded
Voltage - Maximum
Solder Process Data
Duration at Max. Process Temperature (seconds)
Lead-freeProcess Capability
Max. Cycles at Max. Process Temperature
Process Temperature max. C
Material Info
Reference - Drawing Numbers
Product Specification
Sales Drawing
15.0A, 1.0A
1.0 Gbps
75
No
250V AC
005
WAVE
001
260
PS-73780-999-001
SD-73780-004
This document was generated on 11/28/2017
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION