Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | Maxim(美信半导体) |
Parts packaging code | BGA |
package instruction | VFBGA, |
Contacts | 12 |
Reach Compliance Code | compli |
Analog Integrated Circuits - Other Types | SPDT |
JESD-30 code | R-PBGA-B12 |
length | 2.135 mm |
Number of channels | 1 |
Number of functions | 2 |
Number of terminals | 12 |
Nominal off-state isolation | 84 dB |
On-state resistance matching specifications | 0.01 Ω |
Maximum on-state resistance (Ron) | 0.5 Ω |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | VFBGA |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Maximum seat height | 0.69 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 2.3 V |
Nominal supply voltage (Vsup) | 3 V |
surface mount | YES |
Maximum disconnect time | 3000 ns |
Maximum connection time | 60000000 ns |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | BALL |
Terminal pitch | 0.5 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 1.55 mm |