Part Number | Manufacturer | Description | Datasheet |
---|---|---|---|
W83627HF-AW | Winbond Electronics Corporation | winbond I/O | Download |
winbond I/O
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Winbond(华邦电子) |
Parts packaging code | QFP |
package instruction | FQFP, TQFP128,.68X.92 |
Contacts | 128 |
Reach Compliance Code | compli |
Address bus width | 4 |
boundary scan | NO |
Bus compatibility | LPC |
maximum clock frequency | 48 MHz |
External data bus width | 4 |
JESD-30 code | R-PQFP-G128 |
JESD-609 code | e0 |
length | 20 mm |
Number of I/O lines | 30 |
Number of terminals | 128 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | PLASTIC/EPOXY |
encapsulated code | FQFP |
Encapsulate equivalent code | TQFP128,.68X.92 |
Package shape | RECTANGULAR |
Package form | FLATPACK, FINE PITCH |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 3.3,5 V |
Certification status | Not Qualified |
RAM (number of words) | 256 |
Maximum seat height | 3.32 mm |
Maximum supply voltage | 5.5 V |
Minimum supply voltage | 4.5 V |
Nominal supply voltage | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | TIN LEAD |
Terminal form | GULL WING |
Terminal pitch | 0.5 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 14 mm |