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W3H64M72E-400SBM

Showing 4 Results for W3H64M72E-400SBM, including W3H64M72E-400SBM,W3H64M72E-400SBM, etc. You can look for possible substitutions between devices by comparing the similarities and differences between them.
Part Number Manufacturer Description Datasheet
W3H64M72E-400SBM White Electronic Designs Corporation 64M X 72 DDR DRAM, PBGA208 Download
W3H64M72E-400SBM Microsemi DDR DRAM, 64MX72, 0.6ns, CMOS, PBGA208, 16 X 22 MM, 1 MM PITCH, PLASTIC, BGA-208 Download
W3H64M72E-400SBMF White Electronic Designs Corporation DDR DRAM, 64MX72, CMOS, PBGA208, 16 X 22 MM, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-208 Download
W3H64M72E-400SBMF Microsemi DDR DRAM, 64MX72, CMOS, PBGA208, 16 X 22 MM, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-208 Download
W3H64M72E-400SBM Related Product Datasheets:
Part Number Datasheet
W3H64M72E-400SBM 、 W3H64M72E-400SBMF Download Datasheet
W3H64M72E-400SBMF Download Datasheet
W3H64M72E-400SBM Download Datasheet
W3H64M72E-400SBM Related Products:
Part Number W3H64M72E-400SBMF W3H64M72E-400SBM
Description DDR DRAM, 64MX72, CMOS, PBGA208, 16 X 22 MM, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-208 DDR DRAM, 64MX72, 0.6ns, CMOS, PBGA208, 16 X 22 MM, 1 MM PITCH, PLASTIC, BGA-208
Is it Rohs certified? conform to incompatible
Maker Microsemi Microsemi
Parts packaging code BGA BGA
package instruction BGA, 16 X 22 MM, 1 MM PITCH, PLASTIC, BGA-208
Contacts 208 208
Reach Compliance Code compliant unknown
ECCN code EAR99 EAR99
access mode MULTI BANK PAGE BURST MULTI BANK PAGE BURST
Other features AUTO REFRESH AUTO REFRESH
JESD-30 code R-PBGA-B208 R-PBGA-B208
memory density 4831838208 bit 4831838208 bit
Memory IC Type DDR DRAM DDR DRAM
memory width 72 72
Number of functions 1 1
Number of ports 1 1
Number of terminals 208 208
word count 67108864 words 67108864 words
character code 64000000 64000000
Operating mode SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C
organize 64MX72 64MX72
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA
Package shape RECTANGULAR RECTANGULAR
Package form GRID ARRAY GRID ARRAY
Certification status Not Qualified Not Qualified
Maximum supply voltage (Vsup) 1.9 V 1.9 V
Minimum supply voltage (Vsup) 1.7 V 1.7 V
Nominal supply voltage (Vsup) 1.8 V 1.8 V
surface mount YES YES
technology CMOS CMOS
Temperature level MILITARY MILITARY
Terminal form BALL BALL
Terminal location BOTTOM BOTTOM

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