Part Number |
W332M64V-125SBI |
W332M64V-125SBI |
Description |
Synchronous DRAM, 32MX64, 6ns, CMOS, PBGA208, 13 X 22 MM, PLASTIC, BGA-208 |
Synchronous DRAM, 32MX64, 6ns, CMOS, PBGA208, 13 X 22 MM, PLASTIC, BGA-208 |
Maker |
Microsemi |
Mercury Systems Inc |
package instruction |
BGA, |
BGA, |
Reach Compliance Code |
unknown |
unknown |
ECCN code |
EAR99 |
EAR99 |
access mode |
MULTI BANK PAGE BURST |
MULTI BANK PAGE BURST |
Maximum access time |
6 ns |
6 ns |
Other features |
AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED |
AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED |
JESD-30 code |
R-PBGA-B208 |
R-PBGA-B208 |
length |
22.15 mm |
22.15 mm |
memory density |
2147483648 bit |
2147483648 bit |
Memory IC Type |
SYNCHRONOUS DRAM |
SYNCHRONOUS DRAM |
memory width |
64 |
64 |
Number of functions |
1 |
1 |
Number of ports |
1 |
1 |
Number of terminals |
208 |
208 |
word count |
33554432 words |
33554432 words |
character code |
32000000 |
32000000 |
Operating mode |
SYNCHRONOUS |
SYNCHRONOUS |
Maximum operating temperature |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
organize |
32MX64 |
32MX64 |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
BGA |
BGA |
Package shape |
RECTANGULAR |
RECTANGULAR |
Package form |
GRID ARRAY |
GRID ARRAY |
Peak Reflow Temperature (Celsius) |
225 |
225 |
Certification status |
Not Qualified |
Not Qualified |
Maximum seat height |
2.77 mm |
2.77 mm |
self refresh |
YES |
YES |
Maximum supply voltage (Vsup) |
3.6 V |
3.6 V |
Minimum supply voltage (Vsup) |
3 V |
3 V |
Nominal supply voltage (Vsup) |
3.3 V |
3.3 V |
surface mount |
YES |
YES |
technology |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
Terminal form |
BALL |
BALL |
Terminal pitch |
1 mm |
1 mm |
Terminal location |
BOTTOM |
BOTTOM |
Maximum time at peak reflow temperature |
30 |
30 |
width |
13.15 mm |
13.15 mm |