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W332M64V-125SBI

Showing 3 Results for W332M64V-125SBI, including W332M64V-125SBI,W332M64V-125SBI, etc. You can look for possible substitutions between devices by comparing the similarities and differences between them.
Part Number Manufacturer Description Datasheet
W332M64V-125SBI White Electronic Designs Corporation Synchronous DRAM, 32MX64, 6ns, CMOS, PBGA208, 13 X 22 MM, PLASTIC, BGA-208 Download
W332M64V-125SBI Mercury Systems Inc Synchronous DRAM, 32MX64, 6ns, CMOS, PBGA208, 13 X 22 MM, PLASTIC, BGA-208 Download
W332M64V-125SBI Microsemi Synchronous DRAM, 32MX64, 6ns, CMOS, PBGA208, 13 X 22 MM, PLASTIC, BGA-208 Download
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Part Number W332M64V-125SBI W332M64V-125SBI
Description Synchronous DRAM, 32MX64, 6ns, CMOS, PBGA208, 13 X 22 MM, PLASTIC, BGA-208 Synchronous DRAM, 32MX64, 6ns, CMOS, PBGA208, 13 X 22 MM, PLASTIC, BGA-208
Maker Microsemi Mercury Systems Inc
package instruction BGA, BGA,
Reach Compliance Code unknown unknown
ECCN code EAR99 EAR99
access mode MULTI BANK PAGE BURST MULTI BANK PAGE BURST
Maximum access time 6 ns 6 ns
Other features AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED
JESD-30 code R-PBGA-B208 R-PBGA-B208
length 22.15 mm 22.15 mm
memory density 2147483648 bit 2147483648 bit
Memory IC Type SYNCHRONOUS DRAM SYNCHRONOUS DRAM
memory width 64 64
Number of functions 1 1
Number of ports 1 1
Number of terminals 208 208
word count 33554432 words 33554432 words
character code 32000000 32000000
Operating mode SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
organize 32MX64 32MX64
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA
Package shape RECTANGULAR RECTANGULAR
Package form GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) 225 225
Certification status Not Qualified Not Qualified
Maximum seat height 2.77 mm 2.77 mm
self refresh YES YES
Maximum supply voltage (Vsup) 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V
surface mount YES YES
technology CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL
Terminal form BALL BALL
Terminal pitch 1 mm 1 mm
Terminal location BOTTOM BOTTOM
Maximum time at peak reflow temperature 30 30
width 13.15 mm 13.15 mm

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