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W25Q64JVSFIQ

Among 2 related components, W25Q64JVSFIQ have related pdf.
Part Number Manufacturer Description Datasheet
W25Q64JVSFIQ Winbond Electronics Corporation NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 64M-bit 8M x 8 6ns 16-Pin SOIC W Tube Download
W25Q64JVSFIQ TR Winbond Electronics Corporation —— Download
W25Q64JVSFIQ parameters:

Description

NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 64M-bit 8M x 8 6ns 16-Pin SOIC W Tube

Parametric
Parameter NameAttribute value
EU restricts the use of certain hazardous substancesCompliant
ECCN (US)3A991b.1.a.
Part StatusActive
HTS8542.32.00.71
Cell TypeNOR
Chip Density (bit)64M
ArchitectureSectored
Boot BlockNo
Block OrganizationSymmetrical
Address Bus Width (bit)24
Sector Size4Kbyte x 2048
Page Size256byte
Number of Bits/Word (bit)8
Number of Words8M
ProgrammabilityYes
Timing TypeSynchronous
Max. Access Time (ns)6
Maximum Erase Time (s)100/Chip
Maximum Programming Time (ms)3/Page
Process Technology58nm
Interface TypeSerial (SPI, Dual SPI, Quad SPI)
Maximum Operating Frequency (MHz)133
Minimum Operating Supply Voltage (V)2.7
Typical Operating Supply Voltage (V)3|3.3
Maximum Operating Supply Voltage (V)3.6
Programming Voltage (V)2.7 to 3.6
Operating Current (mA)25
Program Current (mA)25
Minimum Operating Temperature (°C)-40
Maximum Operating Temperature (°C)85
Supplier Temperature GradeIndustrial
Command CompatibleYes
ECC SupportNo
Support of Page ModeNo
Minimum Endurance (Cycles)100000
PackagingTube
Supplier PackageSOIC W
Pin Count16
Standard Package NameSOP
MountingSurface Mount
Package Height2.31
Package Length10.31
Package Width7.49
PCB changed16
Lead ShapeGull-wing

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