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W25Q20BWSNIG

Among 1 related components, W25Q20BWSNIG have related pdf.
Part Number Manufacturer Description Datasheet
W25Q20BWSNIG Winbond Electronics Corporation 1.8V 2M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI Download
W25Q20BWSNIG parameters:

Description

1.8V 2M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

Parametric
Parameter NameAttribute value
Is it Rohs certified?conform to
MakerWinbond(华邦电子)
Parts packaging codeSOIC
package instruction0.300 INCH, GREEN, PLASTIC, DIP-8
Contacts8
Reach Compliance Codecompli
ECCN codeEAR99
Maximum clock frequency (fCLK)80 MHz
Data retention time - minimum20
Durability100000 Write/Erase Cycles
JESD-30 codeR-PDSO-G8
length4.9 mm
memory density2097152 bi
Memory IC TypeFLASH
memory width1
Number of functions1
Number of terminals8
word count2097152 words
character code2000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize2MX1
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP8,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply1.8 V
Programming voltage1.8 V
Certification statusNot Qualified
Maximum seat height1.75 mm
Serial bus typeSPI
Maximum standby current0.000005 A
Maximum slew rate0.025 mA
Maximum supply voltage (Vsup)1.95 V
Minimum supply voltage (Vsup)1.65 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
typeNOR TYPE
width3.9 mm
write protectHARDWARE/SOFTWARE

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