Parameter Name | Attribute value |
Brand Name | Texas Instruments |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Texas Instruments(德州仪器) |
Parts packaging code | BGA |
package instruction | VFBGA, BGA56,6X10,25 |
Contacts | 56 |
Reach Compliance Code | _compli |
Factory Lead Time | 1 week |
series | ALVC/VCX/A |
JESD-30 code | R-PBGA-B56 |
JESD-609 code | e0 |
length | 7 mm |
Load capacitance (CL) | 50 pF |
Logic integrated circuit type | BUS DRIVER |
MaximumI(ol) | 0.024 A |
Humidity sensitivity level | 1 |
Number of digits | 8 |
Number of functions | 2 |
Number of ports | 2 |
Number of terminals | 56 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Output characteristics | 3-STATE |
Output polarity | TRUE |
Package body material | PLASTIC/EPOXY |
encapsulated code | VFBGA |
Encapsulate equivalent code | BGA56,6X10,25 |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
method of packing | TAPE AND REEL |
Peak Reflow Temperature (Celsius) | 240 |
power supply | 3.3 V |
Prop。Delay @ Nom-Su | 3.6 ns |
propagation delay (tpd) | 4.9 ns |
Certification status | Not Qualified |
Maximum seat height | 1 mm |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 1.65 V |
Nominal supply voltage (Vsup) | 1.8 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | BALL |
Terminal pitch | 0.65 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 4.5 mm |