Part Number |
PIC16LF1503-E/MG |
PIC16LF1503-E/MV |
PIC16LF1503-E/P |
PIC16LF1503-E/ST |
Description |
8-bit microcontrollers - mcu 3.5kb FL 128b ram 12i/O 10-bit adc |
IC MCU 8BIT 3.5KB FLASH 16UQFN |
8-bit microcontrollers - mcu 3.5kb FL 128b ram 12i/O 10-bit adc |
8-bit microcontrollers - mcu 3.5kb FL 128b ram 12i/O 10-bit adc |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
Maker |
Microchip |
Microchip |
Microchip |
Microchip |
package instruction |
QFN-16 |
UQFN-16 |
DIP-14 |
TSSOP-14 |
Reach Compliance Code |
compli |
compliant |
compli |
compli |
Factory Lead Time |
21 weeks |
24 weeks |
14 weeks |
15 weeks |
Has ADC |
YES |
YES |
YES |
YES |
bit size |
8 |
8 |
8 |
8 |
CPU series |
PIC |
PIC |
PIC |
PIC |
maximum clock frequency |
20 MHz |
20 MHz |
20 MHz |
20 MHz |
DAC channel |
YES |
YES |
YES |
YES |
DMA channel |
NO |
NO |
NO |
NO |
Integrated cache |
NO |
NO |
NO |
NO |
JESD-30 code |
S-PQCC-N16 |
S-PQCC-N16 |
R-PDIP-T14 |
R-PDSO-G14 |
JESD-609 code |
e3 |
e3 |
e3 |
e3 |
length |
3 mm |
3 mm |
19.05 mm |
5 mm |
low power mode |
YES |
YES |
YES |
YES |
Number of I/O lines |
12 |
12 |
12 |
12 |
Number of terminals |
16 |
16 |
14 |
14 |
Number of timers |
2 |
2 |
2 |
2 |
On-chip data RAM width |
8 |
8 |
8 |
8 |
On-chip program ROM width |
14 |
14 |
14 |
14 |
Maximum operating temperature |
125 °C |
125 °C |
125 °C |
125 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
PWM channel |
YES |
YES |
YES |
YES |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
HVQCCN |
VQCCN |
DIP |
TSSOP |
Encapsulate equivalent code |
LCC16,.12SQ,20 |
LCC16,.12SQ,20 |
DIP14,.3 |
TSSOP14,.25 |
Package shape |
SQUARE |
SQUARE |
RECTANGULAR |
RECTANGULAR |
Package form |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
CHIP CARRIER, VERY THIN PROFILE |
IN-LINE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
Peak Reflow Temperature (Celsius) |
260 |
NOT SPECIFIED |
NOT SPECIFIED |
260 |
RAM (bytes) |
128 |
128 |
128 |
128 |
RAM (number of words) |
128 |
128 |
128 |
128 |
rom(word) |
2048 |
2048 |
2048 |
2048 |
ROM programmability |
FLASH |
FLASH |
FLASH |
FLASH |
Maximum seat height |
0.9 mm |
0.55 mm |
5.334 mm |
1.2 mm |
speed |
20 MHz |
20 MHz |
20 MHz |
20 MHz |
Maximum slew rate |
1.8 mA |
1.8 mA |
1.8 mA |
1.8 mA |
Maximum supply voltage |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
Minimum supply voltage |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
Nominal supply voltage |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
surface mount |
YES |
YES |
NO |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
Terminal surface |
Matte Tin (Sn) |
Matte Tin (Sn) |
Matte Tin (Sn) |
Matte Tin (Sn) |
Terminal form |
NO LEAD |
NO LEAD |
THROUGH-HOLE |
GULL WING |
Terminal pitch |
0.5 mm |
0.5 mm |
2.54 mm |
0.65 mm |
Terminal location |
QUAD |
QUAD |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
40 |
NOT SPECIFIED |
NOT SPECIFIED |
40 |
width |
3 mm |
3 mm |
7.62 mm |
4.4 mm |
uPs/uCs/peripheral integrated circuit type |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
Parts packaging code |
QFN |
- |
DIP |
TSSOP |
Contacts |
16 |
- |
14 |
14 |
ECCN code |
EAR99 |
- |
EAR99 |
EAR99 |
power supply |
2/3.3 V |
- |
2/3.3 V |
2/3.3 V |
Certification status |
Not Qualified |
- |
Not Qualified |
Not Qualified |