Part Number |
MT29F512G08CUAAAH1ITZ:A |
MT29F512G08CUAAAH2Z:A |
MT29F512G08CUCABC5-10Z:A |
Description |
Flash, 64GX8, PBGA100, 12 X 18 MM, 1 MM HEIGHT, LEAD FREE, VBGA-100 |
Flash, 64GX8, PBGA100, 12 X 18 MM, 1.20 MM HEIGHT, LEAD FREE, TBGA-100 |
Flash, 64GX8, PBGA52, 14 X 18 MM, 1 MM HEIGHT, PLASTIC, LEAD FREE, VLGA-52 |
Is it lead-free? |
Lead free |
Lead free |
Lead free |
Is it Rohs certified? |
conform to |
conform to |
conform to |
Objectid |
1324543968 |
1324543973 |
1324543985 |
Parts packaging code |
BGA |
BGA |
LGA |
package instruction |
12 X 18 MM, 1 MM HEIGHT, LEAD FREE, VBGA-100 |
12 X 18 MM, 1.20 MM HEIGHT, LEAD FREE, TBGA-100 |
14 X 18 MM, 1 MM HEIGHT, PLASTIC, LEAD FREE, VLGA-52 |
Contacts |
100 |
100 |
52 |
Reach Compliance Code |
compliant |
compliant |
compliant |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
YTEOL |
5.44 |
5.44 |
5.6 |
JESD-30 code |
R-PBGA-B100 |
R-PBGA-B100 |
R-PBGA-B52 |
length |
18 mm |
18 mm |
18 mm |
memory density |
549755813888 bit |
549755813888 bit |
549755813888 bit |
Memory IC Type |
FLASH |
FLASH |
FLASH |
memory width |
8 |
8 |
8 |
Number of functions |
1 |
1 |
1 |
Number of terminals |
100 |
100 |
52 |
word count |
68719476736 words |
68719476736 words |
68719476736 words |
character code |
64000000000 |
64000000000 |
64000000000 |
Operating mode |
ASYNCHRONOUS |
ASYNCHRONOUS |
SYNCHRONOUS |
Maximum operating temperature |
85 °C |
70 °C |
70 °C |
organize |
64GX8 |
64GX8 |
64GX8 |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
VBGA |
TBGA |
VFLGA |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
GRID ARRAY, VERY THIN PROFILE |
GRID ARRAY, THIN PROFILE |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Parallel/Serial |
PARALLEL |
PARALLEL |
PARALLEL |
Programming voltage |
2.7 V |
2.7 V |
2.7 V |
Maximum seat height |
1 mm |
1.2 mm |
1 mm |
Maximum supply voltage (Vsup) |
3.6 V |
3.6 V |
3.6 V |
Minimum supply voltage (Vsup) |
2.7 V |
2.7 V |
2.7 V |
Nominal supply voltage (Vsup) |
3.3 V |
3.3 V |
3.3 V |
surface mount |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
COMMERCIAL |
COMMERCIAL |
Terminal form |
BALL |
BALL |
BUTT |
Terminal location |
BOTTOM |
BOTTOM |
BOTTOM |
type |
MLC NAND TYPE |
MLC NAND TYPE |
MLC NAND TYPE |
width |
12 mm |
12 mm |
14 mm |
JESD-609 code |
e1 |
e1 |
- |
Terminal surface |
TIN SILVER COPPER |
TIN SILVER COPPER |
- |
Terminal pitch |
1 mm |
1 mm |
- |