Part Number |
MAX5732AUTN-T |
MAX5732AUTN |
Description |
Digital to Analog Converters - DAC |
Digital to Analog Converters - DAC 10-Bit 32Ch Precision DAC |
Is it lead-free? |
Contains lead |
Contains lead |
Is it Rohs certified? |
incompatible |
incompatible |
Maker |
Maxim |
Maxim |
Parts packaging code |
QFN |
QFN |
package instruction |
8 X 8 MM, 0.80 MM HEIGHT, MO-220WLLD-5, TQFN-56 |
8 X 8 MM, 0.80 MM HEIGHT, MO-220WLLD-5, TQFN-56 |
Contacts |
56 |
56 |
Reach Compliance Code |
not_compliant |
not_compliant |
Maximum analog output voltage |
5 V |
5 V |
Converter type |
D/A CONVERTER |
D/A CONVERTER |
Enter bit code |
BINARY |
BINARY |
Input format |
SERIAL |
SERIAL |
JESD-30 code |
S-XQCC-N56 |
S-XQCC-N56 |
JESD-609 code |
e0 |
e0 |
length |
8 mm |
8 mm |
Maximum linear error (EL) |
0.0122% |
0.0122% |
Number of digits |
16 |
16 |
Number of functions |
1 |
1 |
Number of terminals |
56 |
56 |
Maximum operating temperature |
85 °C |
85 °C |
Package body material |
UNSPECIFIED |
UNSPECIFIED |
encapsulated code |
HVQCCN |
HVQCCN |
Encapsulate equivalent code |
LCC56,.31SQ,20 |
LCC56,.31SQ,20 |
Package shape |
SQUARE |
SQUARE |
Package form |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
245 |
power supply |
3/5,5 V |
3/5,5 V |
Certification status |
Not Qualified |
Not Qualified |
Maximum seat height |
0.8 mm |
0.8 mm |
Maximum stabilization time |
20 µs |
20 µs |
Nominal settling time (tstl) |
20 µs |
20 µs |
Nominal supply voltage |
5 V |
5 V |
surface mount |
YES |
YES |
technology |
BICMOS |
BICMOS |
Temperature level |
OTHER |
OTHER |
Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn85Pb15) |
Terminal form |
NO LEAD |
NO LEAD |
Terminal pitch |
0.5 mm |
0.5 mm |
Terminal location |
QUAD |
QUAD |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
width |
8 mm |
8 mm |