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GS8644Z36GE-225

Showing 8 Results for GS8644Z36GE-225, including GS8644Z36GE-225,GS8644Z36GE-225I, etc. You can look for possible substitutions between devices by comparing the similarities and differences between them.
Part Number Manufacturer Description Datasheet
GS8644Z36GE-225 GSI Technology SRAM 2.5 or 3.3V 2M x 36 72M Download
GS8644Z36GE-225I GSI Technology Static random access memory 2.5 or 3.3V 2M x 36 72M Download
GS8644Z36GE-225IT GSI Technology ZBT SRAM, 2MX36, 6.5ns, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 Download
GS8644Z36GE-225IV GSI Technology Static random access memory 1.8/2.5V 2M x 36 72M Download
GS8644Z36GE-225IVT GSI Technology ZBT SRAM, 2MX36, 6.5ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 Download
GS8644Z36GE-225T GSI Technology ZBT SRAM, 2MX36, 6.5ns, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 Download
GS8644Z36GE-225V GSI Technology SRAM 1.8/2.5V 2M x 36 72M Download
GS8644Z36GE-225VT GSI Technology ZBT SRAM, 2MX36, 6.5ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 Download
GS8644Z36GE-225 Related Product Datasheets:
Part Number Datasheet
GS8644Z36GE-225IVT 、 GS8644Z36GE-225VT Download Datasheet
GS8644Z36GE-225IV 、 GS8644Z36GE-225V Download Datasheet
GS8644Z36GE-225IT 、 GS8644Z36GE-225T Download Datasheet
GS8644Z36GE-225 、 GS8644Z36GE-225I Download Datasheet
GS8644Z36GE-225 Related Products:
Part Number GS8644Z36GE-225 GS8644Z36GE-225I
Description SRAM 2.5 or 3.3V 2M x 36 72M Static random access memory 2.5 or 3.3V 2M x 36 72M
Is it lead-free? Lead free Lead free
Is it Rohs certified? conform to conform to
Maker GSI Technology GSI Technology
Parts packaging code BGA BGA
package instruction BGA, BGA165,11X15,40 BGA, BGA165,11X15,40
Contacts 165 165
Reach Compliance Code compliant compliant
ECCN code 3A991.B.2.B 3A991.B.2.B
Factory Lead Time 8 weeks 8 weeks
Maximum access time 6.5 ns 6.5 ns
Other features ALSO OPERATES AT 3.3V SUPPLY; PIPELINED OR FLOW-THROUGH ARCHITECTURE ALSO OPERATES AT 3.3V SUPPLY; PIPELINED OR FLOW-THROUGH ARCHITECTURE
Maximum clock frequency (fCLK) 225 MHz 225 MHz
I/O type COMMON COMMON
JESD-30 code R-PBGA-B165 R-PBGA-B165
JESD-609 code e1 e1
length 17 mm 17 mm
memory density 75497472 bit 75497472 bit
Memory IC Type ZBT SRAM ZBT SRAM
memory width 36 36
Humidity sensitivity level 3 3
Number of functions 1 1
Number of terminals 165 165
word count 2097152 words 2097152 words
character code 2000000 2000000
Operating mode SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 85 °C
organize 2MX36 2MX36
Output characteristics 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA
Encapsulate equivalent code BGA165,11X15,40 BGA165,11X15,40
Package shape RECTANGULAR RECTANGULAR
Package form GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 260 260
power supply 2.5/3.3 V 2.5/3.3 V
Certification status Not Qualified Not Qualified
Maximum seat height 1.5 mm 1.5 mm
Maximum standby current 0.12 A 0.16 A
Minimum standby current 2.3 V 2.3 V
Maximum slew rate 0.37 mA 0.405 mA
Maximum supply voltage (Vsup) 2.7 V 2.7 V
Minimum supply voltage (Vsup) 2.3 V 2.3 V
Nominal supply voltage (Vsup) 2.5 V 2.5 V
surface mount YES YES
technology CMOS CMOS
Temperature level COMMERCIAL INDUSTRIAL
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form BALL BALL
Terminal pitch 1 mm 1 mm
Terminal location BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED
width 15 mm 15 mm

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