Part Number |
GS8644Z36GE-225 |
GS8644Z36GE-225I |
Description |
SRAM 2.5 or 3.3V 2M x 36 72M |
Static random access memory 2.5 or 3.3V 2M x 36 72M |
Is it lead-free? |
Lead free |
Lead free |
Is it Rohs certified? |
conform to |
conform to |
Maker |
GSI Technology |
GSI Technology |
Parts packaging code |
BGA |
BGA |
package instruction |
BGA, BGA165,11X15,40 |
BGA, BGA165,11X15,40 |
Contacts |
165 |
165 |
Reach Compliance Code |
compliant |
compliant |
ECCN code |
3A991.B.2.B |
3A991.B.2.B |
Factory Lead Time |
8 weeks |
8 weeks |
Maximum access time |
6.5 ns |
6.5 ns |
Other features |
ALSO OPERATES AT 3.3V SUPPLY; PIPELINED OR FLOW-THROUGH ARCHITECTURE |
ALSO OPERATES AT 3.3V SUPPLY; PIPELINED OR FLOW-THROUGH ARCHITECTURE |
Maximum clock frequency (fCLK) |
225 MHz |
225 MHz |
I/O type |
COMMON |
COMMON |
JESD-30 code |
R-PBGA-B165 |
R-PBGA-B165 |
JESD-609 code |
e1 |
e1 |
length |
17 mm |
17 mm |
memory density |
75497472 bit |
75497472 bit |
Memory IC Type |
ZBT SRAM |
ZBT SRAM |
memory width |
36 |
36 |
Humidity sensitivity level |
3 |
3 |
Number of functions |
1 |
1 |
Number of terminals |
165 |
165 |
word count |
2097152 words |
2097152 words |
character code |
2000000 |
2000000 |
Operating mode |
SYNCHRONOUS |
SYNCHRONOUS |
Maximum operating temperature |
70 °C |
85 °C |
organize |
2MX36 |
2MX36 |
Output characteristics |
3-STATE |
3-STATE |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
BGA |
BGA |
Encapsulate equivalent code |
BGA165,11X15,40 |
BGA165,11X15,40 |
Package shape |
RECTANGULAR |
RECTANGULAR |
Package form |
GRID ARRAY |
GRID ARRAY |
Parallel/Serial |
PARALLEL |
PARALLEL |
Peak Reflow Temperature (Celsius) |
260 |
260 |
power supply |
2.5/3.3 V |
2.5/3.3 V |
Certification status |
Not Qualified |
Not Qualified |
Maximum seat height |
1.5 mm |
1.5 mm |
Maximum standby current |
0.12 A |
0.16 A |
Minimum standby current |
2.3 V |
2.3 V |
Maximum slew rate |
0.37 mA |
0.405 mA |
Maximum supply voltage (Vsup) |
2.7 V |
2.7 V |
Minimum supply voltage (Vsup) |
2.3 V |
2.3 V |
Nominal supply voltage (Vsup) |
2.5 V |
2.5 V |
surface mount |
YES |
YES |
technology |
CMOS |
CMOS |
Temperature level |
COMMERCIAL |
INDUSTRIAL |
Terminal surface |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal form |
BALL |
BALL |
Terminal pitch |
1 mm |
1 mm |
Terminal location |
BOTTOM |
BOTTOM |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
width |
15 mm |
15 mm |