Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | Microchip(微芯科技) |
package instruction | DIP, DIP24,.3 |
Reach Compliance Code | compliant |
Factory Lead Time | 12 weeks |
Architecture | PAL-TYPE |
maximum clock frequency | 25 MHz |
JESD-30 code | R-PDIP-T24 |
JESD-609 code | e3 |
length | 31.887 mm |
Humidity sensitivity level | 1 |
Dedicated input times | 11 |
Number of I/O lines | 10 |
Number of entries | 22 |
Output times | 10 |
Number of product terms | 132 |
Number of terminals | 24 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 11 DEDICATED INPUTS, 10 I/O |
Output function | MACROCELL |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP24,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Peak Reflow Temperature (Celsius) | 245 |
power supply | 3.3/5 V |
Programmable logic type | FLASH PLD |
propagation delay | 30 ns |
Certification status | Not Qualified |
Maximum seat height | 5.334 mm |
Maximum supply voltage | 5.5 V |
Minimum supply voltage | 3 V |
Nominal supply voltage | 3.3 V |
surface mount | NO |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Matte Tin (Sn) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 7.62 mm |