Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | AMD(超微) |
Parts packaging code | QFP |
package instruction | TQFP-100 |
Contacts | 100 |
Reach Compliance Code | _compli |
Has ADC | NO |
Address bus width | 20 |
bit size | 16 |
maximum clock frequency | 12.5 MHz |
DAC channel | NO |
DMA channel | YES |
External data bus width | 16 |
JESD-30 code | S-PQFP-G100 |
JESD-609 code | e0 |
length | 14 mm |
Humidity sensitivity level | 3 |
Number of I/O lines | 32 |
Number of terminals | 100 |
Maximum operating temperature | 100 °C |
Minimum operating temperature | |
PWM channel | NO |
Package body material | PLASTIC/EPOXY |
encapsulated code | LFQFP |
Encapsulate equivalent code | QFP100,.63SQ,20 |
Package shape | SQUARE |
Package form | FLATPACK, LOW PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 3.3 V |
Certification status | Not Qualified |
Maximum seat height | 1.6 mm |
speed | 50 MHz |
Maximum supply voltage | 3.6 V |
Minimum supply voltage | 3 V |
Nominal supply voltage | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | OTHER |
Terminal surface | Tin/Lead (Sn85Pb15) |
Terminal form | GULL WING |
Terminal pitch | 0.5 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 14 mm |
uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |