Parameter Name | Attribute value |
Brand Name | Texas Instruments |
Is it lead-free? | Contains lead |
Is it Rohs certified? | conform to |
Parts packaging code | BGA |
package instruction | FBGA, BGA256,16X16,40 |
Contacts | 256 |
Reach Compliance Code | compli |
Factory Lead Time | 1 week |
Address bus width | 16 |
bit size | 32 |
boundary scan | YES |
maximum clock frequency | 20 MHz |
External data bus width | 16 |
Format | FIXED POINT |
Integrated cache | YES |
JESD-30 code | S-PBGA-B256 |
JESD-609 code | e1 |
length | 17 mm |
low power mode | YES |
Humidity sensitivity level | 3 |
Number of terminals | 256 |
Maximum operating temperature | 105 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | FBGA |
Encapsulate equivalent code | BGA256,16X16,40 |
Package shape | SQUARE |
Package form | GRID ARRAY, FINE PITCH |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 1.2,1.8/3.3 V |
Certification status | Not Qualified |
Maximum seat height | 2.05 mm |
speed | 375 MHz |
Maximum supply voltage | 1.32 V |
Minimum supply voltage | 1.14 V |
Nominal supply voltage | 1.2 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal form | BALL |
Terminal pitch | 0.5 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 17 mm |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC |
Base Number Matches | 1 |