Parameter Name | Attribute value |
Brand Name | Integrated Device Technology |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | IDT (Integrated Device Technology) |
Parts packaging code | TQFP |
package instruction | LQFP, QFP64,.63SQ,32 |
Contacts | 64 |
Manufacturer packaging code | PNG64 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Samacsys Description | TQFP 14.0 X 14.0 X 1.4 MM |
Maximum access time | 8 ns |
Other features | RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH |
Maximum clock frequency (fCLK) | 100 MHz |
period time | 10 ns |
JESD-30 code | S-PQFP-G64 |
JESD-609 code | e3 |
length | 14 mm |
memory density | 294912 bit |
Memory IC Type | OTHER FIFO |
memory width | 9 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of terminals | 64 |
word count | 32768 words |
character code | 32000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 32KX9 |
Exportable | YES |
Package body material | PLASTIC/EPOXY |
encapsulated code | LQFP |
Encapsulate equivalent code | QFP64,.63SQ,32 |
Package shape | SQUARE |
Package form | FLATPACK, LOW PROFILE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 1.6 mm |
Maximum standby current | 0.02 A |
Maximum slew rate | 0.075 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | MATTE TIN |
Terminal form | GULL WING |
Terminal pitch | 0.8 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | 30 |
width | 14 mm |