Parameter Name | Attribute value |
Brand Name | Integrated Device Technology |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | IDT (Integrated Device Technology) |
Parts packaging code | TQFP |
package instruction | TQFP-100 |
Contacts | 100 |
Manufacturer packaging code | PN100 |
Reach Compliance Code | not_compliant |
ECCN code | 3A991.B.2.B |
Maximum access time | 20 ns |
I/O type | COMMON |
JESD-30 code | S-PQFP-G100 |
JESD-609 code | e0 |
length | 14 mm |
memory density | 589824 bit |
Memory IC Type | DUAL-PORT SRAM |
memory width | 18 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of ports | 2 |
Number of terminals | 100 |
word count | 32768 words |
character code | 32000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 32KX18 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | LFQFP |
Encapsulate equivalent code | QFP100,.63SQ,20 |
Package shape | SQUARE |
Package form | FLATPACK, LOW PROFILE, FINE PITCH |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 240 |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 1.6 mm |
Minimum standby current | 4.5 V |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn85Pb15) |
Terminal form | GULL WING |
Terminal pitch | 0.5 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | 20 |
width | 14 mm |
Base Number Matches | 1 |