Parameter Name | Attribute value |
Dimensions | SFP+ |
cage type | stack |
Radiator included | no |
Connector System | cable to board |
Sealable | no |
Connectors and terminals terminate to | A printed circuit board |
Port matrix configuration | 2 x 4 |
Number of ports | 8 |
Number of Positions | 160 |
Data rate (max) (Gb/s) | 16 |
Terminal contact plating material | Palladium nickel alloy gold plating |
Terminal contact plating thickness (µm) | .76 |
Tail plating material | tin |
PCB Termination Methods | Through hole - solderless connection |
PCB installation method | Through hole solderless connection |
Connector mounting type | board mounting |
cage material | nickel silver |
Centerline (Pitch) | .8 mm [ .0315 in ] |
PCB thickness (recommended) | 1.5 mm [ .059 in ] |
tail length | 3 mm [ .118 in ] |
Working group temperature range | -55 – 105 °C [ -67 – 221 °F ] |
Pluggable I/O Applications | EMI enhanced |
Circuit Application | Signal |
Compatible radiators | no |
UL flammability rating | UL 94V-0 |
Encapsulation method | tray |
EMI containment feature types | external spring |
Light pipe included | no |