Basic information of TLV2773CNE4 amplifier:
TLV2773CNE4 is an OPERATIONAL AMPLIFIER. Commonly used packaging methods are DIP, DIP14,.3
TLV2773CNE4 amplifier core information:
The minimum operating temperature of the TLV2773CNE4 is , and the maximum operating temperature is 70 °C.
The maximum slew rate of the TLV2773CNE4 given by the manufacturer is 4 mA, while the minimum slew rate is 4.7 V/us. Its minimum voltage gain is 13000. The power of TLV2773CNE4 is NO. Its programmable power is NO.
The power supply range is: 2.7/5 V. The input offset voltage of the TLV2773CNE4 is 2700 µV (input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).)
Related dimensions of TLV2773CNE4:
TLV2773CNE4 has 14 terminals. Its terminal position type is: DUAL. Terminal pitch is 2.54 mm.
TLV2773CNE4 amplifier additional information:
TLV2773CNE4 adopts the VOLTAGE-FEEDBACK architecture. It belongs to the low-bias class of amplifiers. It does not belong to the low offset class of amplifiers. The frequency compensation status of TLV2773CNE4 is: YES. Its temperature grade is: COMMERCIAL.
It is not a micropower amplifier. The corresponding JESD-30 code is: R-PDIP-T14. The packaging code of TLV2773CNE4 is: DIP. The materials used for TLV2773CNE4 packaging are mostly PLASTIC/EPOXY. The package shape is RECTANGULAR.
The TLV2773CNE4 package pin format is: IN-LINE. Its terminal form is: THROUGH-HOLE.
Basic information of TLV2773CNE4 amplifier:
TLV2773CNE4 is an OPERATIONAL AMPLIFIER. Commonly used packaging methods are DIP, DIP14,.3
TLV2773CNE4 amplifier core information:
The minimum operating temperature of the TLV2773CNE4 is , and the maximum operating temperature is 70 °C.
The maximum slew rate of the TLV2773CNE4 given by the manufacturer is 4 mA, while the minimum slew rate is 4.7 V/us. Its minimum voltage gain is 13000. The power of TLV2773CNE4 is NO. Its programmable power is NO.
The power supply range is: 2.7/5 V. The input offset voltage of the TLV2773CNE4 is 2700 µV (input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).)
Related dimensions of TLV2773CNE4:
TLV2773CNE4 has 14 terminals. Its terminal position type is: DUAL. Terminal pitch is 2.54 mm.
TLV2773CNE4 amplifier additional information:
TLV2773CNE4 adopts the VOLTAGE-FEEDBACK architecture. It belongs to the low-bias class of amplifiers. It does not belong to the low offset class of amplifiers. The frequency compensation status of TLV2773CNE4 is: YES. Its temperature grade is: COMMERCIAL.
It is not a micropower amplifier. The corresponding JESD-30 code is: R-PDIP-T14. The packaging code of TLV2773CNE4 is: DIP. The materials used for TLV2773CNE4 packaging are mostly PLASTIC/EPOXY. The package shape is RECTANGULAR.
The TLV2773CNE4 package pin format is: IN-LINE. Its terminal form is: THROUGH-HOLE.
| Parameter Name | Attribute value |
| Maker | Texas Instruments |
| package instruction | DIP, DIP14,.3 |
| Reach Compliance Code | unknown |
| Amplifier type | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK |
| frequency compensation | YES |
| Maximum input offset voltage | 2700 µV |
| JESD-30 code | R-PDIP-T14 |
| low-bias | YES |
| low-dissonance | NO |
| micropower | NO |
| Number of functions | 2 |
| Number of terminals | 14 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power | NO |
| power supply | 2.7/5 V |
| Programmable power | NO |
| Certification status | Not Qualified |
| minimum slew rate | 4.7 V/us |
| Maximum slew rate | 4 mA |
| Supply voltage upper limit | 7 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Minimum voltage gain | 13000 |
| broadband | NO |
| Base Number Matches | 1 |
| TLV2773CNE4 | TLV2774AIPWRG4 | TLV2770IDGKG4 | TLV2775CPWG4 | TLV2775CPWRG4 | |
|---|---|---|---|---|---|
| Description | IC,OP-AMP,DUAL,CMOS,DIP,14PIN,PLASTIC | IC,OP-AMP,QUAD,CMOS,TSSOP,14PIN,PLASTIC | IC,OP-AMP,SINGLE,CMOS,TSSOP,8PIN,PLASTIC | IC,OP-AMP,QUAD,CMOS,TSSOP,16PIN,PLASTIC | IC,OP-AMP,QUAD,CMOS,TSSOP,16PIN,PLASTIC |
| Maker | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| package instruction | DIP, DIP14,.3 | TSSOP, TSSOP14,.25 | TSSOP, TSSOP8,.19 | TSSOP, TSSOP16,.25 | TSSOP, TSSOP16,.25 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| Amplifier type | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
| frequency compensation | YES | YES | YES | YES | YES |
| Maximum input offset voltage | 2700 µV | 2200 µV | 2700 µV | 2700 µV | 2700 µV |
| JESD-30 code | R-PDIP-T14 | R-PDSO-G14 | R-PDSO-G8 | R-PDSO-G16 | R-PDSO-G16 |
| low-bias | YES | YES | YES | YES | YES |
| low-dissonance | NO | NO | NO | NO | NO |
| Number of functions | 2 | 4 | 1 | 4 | 4 |
| Number of terminals | 14 | 14 | 8 | 16 | 16 |
| Maximum operating temperature | 70 °C | 125 °C | 125 °C | 70 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | TSSOP | TSSOP | TSSOP | TSSOP |
| Encapsulate equivalent code | DIP14,.3 | TSSOP14,.25 | TSSOP8,.19 | TSSOP16,.25 | TSSOP16,.25 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| power supply | 2.7/5 V | 2.7/5 V | 2.7/5 V | 2.7/5 V | 2.7/5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| minimum slew rate | 4.7 V/us | 4.7 V/us | 4.7 V/us | 4.7 V/us | 4.7 V/us |
| Maximum slew rate | 4 mA | 8 mA | 2 mA | 8 mA | 8 mA |
| Supply voltage upper limit | 7 V | 7 V | 7 V | 7 V | 7 V |
| surface mount | NO | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | AUTOMOTIVE | AUTOMOTIVE | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 2.54 mm | 0.65 mm | 0.635 mm | 0.635 mm | 0.635 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
| Minimum voltage gain | 13000 | 13000 | 13000 | 13000 | 13000 |
| micropower | NO | - | NO | NO | NO |
| power | NO | - | NO | NO | NO |
| Programmable power | NO | - | NO | NO | NO |
| broadband | NO | - | NO | NO | NO |
| Is it Rohs certified? | - | conform to | conform to | conform to | conform to |
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD