ZMM5229B_R1_10001 datasheet, PDF

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ZMM5229B_R1_10001: DescriptionMaximum power: 500mW Accuracy: - Reverse leakage current: 5uA @ 1V Regulated voltage value (typical value): 4.3V 4.3V 500mW; CategoryDiscrete semiconductor diode; File Size231KB，6 Pages; ManufacturerPANJIT; Websitehttp://www.panjit.com.tw/; Environmental Compliance; PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.

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ZMM5229B_R1_10001 Overview

Maximum power: 500mW Accuracy: - Reverse leakage current: 5uA @ 1V Regulated voltage value (typical value): 4.3V 4.3V 500mW

ZMM5229B_R1_10001 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	PANJIT
package instruction	O-LELF-R2
Reach Compliance Code	compliant
ECCN code	EAR99
Is Samacsys	N
Shell connection	ISOLATED
Configuration	SINGLE
Diode component materials	SILICON
Diode type	ZENER DIODE
Maximum dynamic impedance	22 Ω
JESD-30 code	O-LELF-R2
Maximum knee impedance	2000 Ω
Number of components	1
Number of terminals	2
Maximum operating temperature	175 °C
Minimum operating temperature	-65 °C
Package body material	GLASS
Package shape	ROUND
Package form	LONG FORM
polarity	UNIDIRECTIONAL
Maximum power dissipation	0.5 W
Nominal reference voltage	4.3 V
Maximum reverse current	5 µA
Reverse test voltage	1 V
surface mount	YES
technology	ZENER
Terminal form	WRAP AROUND
Terminal location	END
Maximum voltage tolerance	5%
Working test current	20 mA
Base Number Matches	1

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ZMM5221B~ZMM5266B

SURFACE MOUNT ZENER DIODES

VOLTAGE

2.4 to 68 Volt

POWER

500 mWatt

FEATURES

• Planar Die construction

• 500mW Power Dissipation

• Ideally Suited for Automated Assembly Processes

0.063(1.6)

0.020(0.5)

0.012(0.3)

0.146(3.7)

0.130(3.3)

• Lead free in compliance with EU RoHS 2.0

MECHANICAL DATA

• Case: Molded Glass MINI-MELF

• Terminals: Solderable per MIL-STD-750, Method 2026

• Approx. Weight: 0.001

ounces, 0.03

grams

• Packing information

T/R - 2.5K per 7" plastic Reel

0.020(0.5)

0.012(0.3)

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Parameter

Power Dissipation at T

= 25

Operating Junction Temperature Range

Storage Temperature Range

Valid provided that leads at a distance of 10mm from case are kept at ambient temperature.

Symbol

TOT

STG

Value

500

-65 to +175

Units

Parameter

Thermal Resistance Junction to Ambient Air

Forward Voltage at I

= 200mA

Symbol

JA

Min.

Typ.

Max.

0.3

1.1

Units

C/mW

Valid provided that leads at a distance of 10mm from case are kept at ambient temperature.

0.055(1.4)DIA.

January 25,2019-REV.08

PAGE . 1

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