3PEAK is a global semiconductor supplier that provides analog power, signal chain and embedded processor product portfolios. It is committed to the research and development of high-performance, high-quality, and high-reliability integrated circuit products to provide customers with comprehensive solutions. Its product applications cover many fields such as communications, industry, security monitoring, medical and health, instrumentation, new energy, and automotive industries. 3PEAK is headquartered in Plano, Texas, USA and Shanghai, China, with a global support team and resources to help customers.
The TP600X series are CMOS dual, and quad RRIO op-amps
with low offset, low power and stable high frequency response.
They incorporate 3PEAK’s proprietary and patented design
techniques to achieve very good AC performance with 1MHz
bandwidth, 0.6V/μs slew rate and low distortion while drawing
only 80μA of quiescent current per amplifier. The input common-
mode voltage range extends 300mV beyond V– and V+, and
the outputs swing rail-to-rail. The TP600X family can be used as
plug-in replacements for many commercially available op-amps
to reduce power and improve input/output range and
performance.
The combination of features makes the TP600X ideal choices
for motor control and portable audio amplification, sound ports,
Applications
Active Filters, ASIC Input or Output Amplifier
Sensor Interface
Smoke/Gas/Environment Sensors
Portable Instruments and Mobile Device
and other consumer Audio. The TP600X Op-amp is very stable,
and it is capable of driving heavy capacitive loads such as those
found in LCDs. The ability to swing rail-to-rail at the inputs and
outputs enables designers to buffer CMOS DACs, ASICs, or
other wide output swing devices in single-supply systems.
Pin Configuration
TP6001
5-Pin SOT23/SC70
-T and -C Suffixes
﹢Vs
1
2
3
4
Out
TP6001U
5-Pin SOT23/SC70
-T and -C Suffixes
5
+In
-V
S
4
- In
-In
5
+V
S
Out A
﹣In
A
﹢In
A
﹣Vs
TP6002
8-Pin SOIC/TSSOP/MSOP
-S, -T, -TS and -V Suffixes
﹢Vs
Out B
﹣In
B
﹢In
B
Out A
﹣In
A
﹢In
A
﹢Vs
﹢In
B
1
2
A
TP6004
14-Pin SOIC/TSSOP
-S and -T Suffixes
14
13
D
Out
﹣Vs
+ In
1
2
3
1
2
3
4
A
8
7
B
Out D
﹣In
D
﹢In
D
﹣Vs
﹢In
C
﹣In
C
Out C
6
5
3
4
5
B
C
12
11
10
9
8
TP6001R
5-Pin SOT23
-T Suffixes
Out A
Out
+ Vs
+ In
1
2
3
4
- In
5
- Vs
﹣In
A
﹢In
A
﹣Vs
2
3
4
1
TP6002
8-Pin DFN 2*2
(-F Suffix)
8
7
6
5
﹢Vs
Out B
﹣In
B
﹢In
B
﹣In
B
Out B
6
7
The thermal pad of DFN package is recommended
to be left float or connected to -Vs
www.3peakic.com.cn
1 / 17
Rev.0.04
TP6001/TP6002/TP6004
1MHz, 80μA, RRIO, Op Amps
Table of Contents
Features ........................................................................................................................................................................... 1
Table of Contents ............................................................................................................................................................ 2
Revision History .............................................................................................................................................................. 3
Order Information ............................................................................................................................................................ 3
Thermal Information ....................................................................................................................................................... 4
Application Information .................................................................................................................................................. 9
Low Supply Voltage and Low Power Consumption ...................................................................................................................... 9
Ground Sensing and Rail to Rail Output ...................................................................................................................................... 9
Driving Large Capacitive Load ..................................................................................................................................................... 9
Tape and Reel Information ........................................................................................................................................... 10
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Embedded System
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