SS9018H datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Discrete semiconductor> The transistor> SS9018H

SS9018H: DescriptionTransistor; CategoryDiscrete semiconductor The transistor; File Size174KB，1 Pages; ManufacturerJCET; Websitehttp://www.cj-elec.com/; Jiangsu Changdian Technology Co., Ltd. focuses on semiconductor packaging and testing business, providing customers at home and abroad with a full range of solutions such as chip testing, packaging design, packaging testing, etc. The company was successfully listed on the Shanghai Main Board in 2003, becoming the first semiconductor packaging and testing listed company in China. It now has a national enterprise technology center and a postdoctoral research workstation. It is a national key high-tech enterprise, a supporting unit of the National Engineering Laboratory for High-density Integrated Circuits, and the chairman unit of the Integrated Circuit Packaging Technology Innovation Strategic Alliance.

Discrete devices: diodes (switching diodes, Schottky diodes (Schottky rectifiers), voltage regulator diodes, Pin diodes, TVS diodes, rectifier diodes, fast recovery diodes); transistors (Darlington tubes, digital transistors, MOSFETs); thyristors: silicon-controlled rectifiers, triacs; composite tubes: transistors + field-effect tubes, dual transistors, dual digital transistors, digital transistors + transistors, transistors + diodes, field-effect tubes + diodes, dual field-effect tubes. Voltage regulator circuit; energy-saving lamp charger switch tube

Lead frame: TO series (TO); SOD series (SOD); SOT series (TSOT, SOT); FBP series (WBFBP); QFN series (QFNWB, DFNWB, DFNFC, QFNFC); QFP series (LQFP: PQFP: PLCC: TQFP); SIP series (SIP, HSIP, FSIP); SOP series (SOP, HSOP, SSOP, MSOP, HTSOP, TSSOP); DIP series (DIP, FDIP, SDIP); PDFN series; PQFN series; MIS series (MISFC, MISWB)

Nine core technologies: Through Silicon Via (TSV) packaging technology; SiP RF packaging technology; wafer-level 3D rewiring packaging process technology; copper bump interconnection technology; high-density FC-BGA packaging and testing technology (Flip Chip BGA); multi-turn array four-sided pinless packaging and testing technology; package body 3D stacking technology; 50μm or less ultra-thin chip 3D stacking packaging technology; MEMS multi-chip packaging technology; MIS packaging technology (pre-encapsulated interconnection system); BGA packaging technology, etc.

Download Datasheet Parametric View All

SS9018H Overview

Transistor

SS9018H Parametric

Parameter Name	Attribute value
Maker	JCET
package instruction	,
Reach Compliance Code	unknown

SS9018H Preview

Download Datasheet

View All

JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD

TO-92 Plastic-Encapsulate Transistors

SS9018

TRANSISTOR (NPN)

TO-92

1.EMITTER

FEA TURES

High Current Gain Bandwidth Product

2.BASE

MAXIMUM RATINGS (T

=25℃ unless otherwise noted)

Symbol

CBO

CEO

EBO

θJA

stg

Parameter

Collector-Base Voltage

Collector-Emitter Voltage

Emitter-Base Voltage

Collector Current -Continuous

Collector Power Dissipation

Junction Temperature

Storage Temperature

Value

Units

0.4

150

℃

3.COLLECTOR

Thermal Resistance from Junction to Ambient 312.5

℃/W

-55-150

℃

ELECTRICAL CHARACTERISTICS (T

=25℃ unless otherwise specified)

Parameter

Collector-base breakdown voltage

Collector-emitter breakdown voltage

Emitter-base breakdown voltage

Collector cut-off current

Emitter cut-off current

DC current gain

Collector-emitter saturation voltage

Base-emitter saturation voltage

Transition frequency

Symbol

(BR)CBO

(BR)CEO

(BR)EBO

CBO

CEO

EBO

CE(sat)

BE(sat)

Test conditions

= 100μA, I

= 0.1mA, I

= 100μA, I

= 20V, I

=15V,I

=3V, I

=5V, I

= 1mA

=10mA, I

=1mA

=10mA,I

=1mA

=5 V, I

=5mA

f =400MHz

1.2

Min

0.1

270

0.5

1.42

GHz

Typ

Max

Unit

μA

CLASSIFICATION OF h

Rank

Ra nge

28-45

39-60

54-80

72-108

97-146

132-198

180-270

A,May,2011

Recommended Resources

Modern home automation remote control systemc

Feedforward compensation method circuit

Audio amplifier circuit for record player

Hot water boiler temperature control circuit

YDSXX series basic application circuit diagram

JJlB-11～75/380-1/2 type auto-coupling step-down starter circuit

[New Year's Festival Competition] + More than 200 girls walk: [i=s] This post was last edited by Fei Yang Zi Ji on 2019-2-15 22:10 [/i] [size=4] During the New Year, our village holds a ceremony where all married girls return home to worship their ancestors. [/s...; 飞扬自我 Talking

Introduction to PLC, excerpted from "Control Engineer": In production process automation devices, PLC and DCS are the two most widely used control systems. Before the 1980s, the I/O cards of these control systems were concentrated in control rooms far away...; 1234 Industrial Control Electronics

Postpartum lamp - what kind of light do women need during confinement?: How hard it is to be in confinement after childbirth, you will only understand it after you have a child.Lighting is an extremely important auxiliary factor, but also one that is easily overlooked.Do ...; 岁月留痕 Creative Market

Introduction to RF5 Architecture: RF5是德州仪器TI公司DSP软件开发的起步代码参考框架，它以DSP/BIOS为基础，利用其中的数据处理元素和数据通信元素方便快捷地完成DSP软件的设计与开发。RF5是RF的最新版本，其区别于RF1和RF3的显著特点是其支持动态对象创建和支持线程（任务）挂起功能，因此适合系统较复杂的应用场合。 RF5 mainly implements three functions, storage manag...; 灞波儿奔 DSP and ARM Processors

The relationship between standard, bandwidth, and baud rate/speed: The relationship between standard, bandwidth, and baud rate/speedAre 3G, 4G, and 5G just a standard? Are they not necessarily related to the communication speed? Are units such as kbps, bit/s, Bps, bu...; QWE4562009 Test/Measurement

Share some free ADI high-quality materials and prize-winning activities, welcome everyone to actively participate in the download!: 1. Download with rewards丨The last battle of the battle against demons, 5-in-1 magic and electricity cheats are now online! From now until August 31st, click hereto enter , fill in the information to d...; eric_wang Analog electronics

Popular Components