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According to the latest survey by TrendForce's TrendForce subsidiary, TrendForce, foundry orders did not decline significantly in the first quarter of 2020, and customers expanded demand for existing...[Details]
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Recently, Texas Instruments (TI) held the 2021 TI Live! TECH EXCHANGE online seminar, focusing on the four major technology areas of automobiles, real-time control, visual sensing, and power manageme...[Details]
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According to foreign media reports, in order to speed up the pace of forming the "Chip Quad Alliance", the United States previously unilaterally set August 31 as the deadline, requiring South Korea t...[Details]
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Integrating 2D materials into traditional semiconductor manufacturing processes could be one of the more radical changes in the history of the chip industry. Although the introduction of any new ma...[Details]
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On June 10, 2020, ARM and Hopu Investments jointly issued a statement saying that they had reached a decision to remove Wu Xiong'ang, chairman and CEO of ARM China. The original text is as follows:...[Details]
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IPnest released the Design IP Report in April 2023, by category (CPU, DSP, GPU & ISP, Wired Interfaces, SRAM Memory Compilers, Flash Compilers, Libraries & I/O, AMS, Wireless Interfaces, Infrastructu...[Details]
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TSMC finally compromised with the United States. With less than a month to go before the deadline set by the US government, a US Department of Commerce spokesperson revealed on the 21st local time...[Details]
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IC Insights recently released its forecast for the global IC market in 2021, which is expected to increase by 10% to 13% compared to 2019. In 2020, the COVID-19 pandemic accelerated the digital tra...[Details]
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According to the latest data released by market research firm Gartner, chip spending by the world's top ten OEMs fell by 7.6% year-on-year in 2022, accounting for 37.2% of the entire market. Apple wi...[Details]
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Beijing time, April 16 morning news, reportedly, Toshiba is considering rejecting the acquisition offer of British private equity fund CVC. Toshiba executives told major banks that the company "ab...[Details]
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Recently, Teledyne-e2v (hereinafter referred to as e2v) participated in the annual EDICON. At EDICON, e2v demonstrated the 16×16 mm package multi-channel 12-bit analog-to-digital converter (ADC) EV12...[Details]
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About the author: Zhu Jing: Senior economist of Beijing International Engineering Consulting Co., Ltd., Deputy Secretary-General of Beijing Semiconductor Industry Association Abstract: The semicond...[Details]
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TSMC broke the news that the 3nm process will be ramped up in the second half of the year. In addition, TSMC also stated that customers are very enthusiastic about the 2nm process, and it is planned ...[Details]
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Taiwan regulators will soon have new powers to block technology companies from selling their mainland China subsidiaries or other assets, the latest move by the local government to prevent sensitive ...[Details]
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German media reported that Intel will receive about 6.8 billion euros in subsidies for its planned Magdeburg plant. About 2.7 billion euros have been reserved in the 2022 federal government budget, a...[Details]