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SB2020CT

Description
Schottky diodes
CategoryDiscrete semiconductor    diode   
ManufacturerPANJIT
Websitehttp://www.panjit.com.tw/
Environmental Compliance

PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values ​​include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.

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SB2020CT Overview

Schottky diodes

Features

Product Name: Schottky Diode


Product model: SB2020CT


parameter:


Repetitive reverse voltage peak Vrrm: 20V


Maximum average rectified current Io: 20A


Maximum forward surge current I FSM: 200A


Forward voltage drop VF: 0.55V when IF=10A


Maximum feedback current IR: 200uA when VR=20V


Package: TO-220AB


SB2020CT Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerPANJIT
Parts packaging codeTO-220AB
package instructionROHS COMPLIANT, PLASTIC PACKAGE-3
Contacts3
Reach Compliance Code_compli
ECCN codeEAR99
Other featuresFREE WHEELING DIODE, LOW POWER LOSS
applicationEFFICIENCY
ConfigurationCOMMON CATHODE, 2 ELEMENTS
Diode component materialsSILICON
Diode typeRECTIFIER DIODE
Maximum forward voltage (VF)0.55 V
JEDEC-95 codeTO-220AB
JESD-30 codeR-PSFM-T3
Maximum non-repetitive peak forward current200 A
Number of components2
Phase1
Number of terminals3
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Maximum output current10 A
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formFLANGE MOUNT
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Maximum repetitive peak reverse voltage20 V
surface mountNO
technologySCHOTTKY
Terminal formTHROUGH-HOLE
Terminal locationSINGLE
Maximum time at peak reflow temperatureNOT SPECIFIED

SB2020CT Preview

Download Datasheet
SB2020CT SERIES
SCHOTTKY BARRIER RECTIFIERS
VOLTAGE
FEATURES
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-O.
Flame Retardant Epoxy Molding Compound.
• Exceeds environmental standards of MIL-S-19500/228
• Low forwrd voltage, high current capability
• High surge capacity.
• For use in low voltage,high frequency inverters
free wheeling , and polarlity protection applications.
• In compliance with EU RoHS 2002/95/EC directives
0.177(4.5)
MAX.
0.058(1.47)
0.042(1.07)
0.038(0.96)
0.019(0.50)
0.50(12.7)MIN.
0.115(2.92)
0.080(2.03)
0.025(0.65)MAX.
0.624(15.87)
0.548(13.93)
0.419(10.66)
0.387(9.85)
0.139(3.55)
MIN.
0.196(5.00)
0.163(4.16)
0.054(1.39)
0.045(1.15)
20 to 60 Volts
CURRENT
20 Amperes
• Low power loss, high efficiency.
MECHANCAL DATA
• Case: TO-220AB Molded plastic
• Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
• Polarity: As marked.
• Standard packaging: Any
• Weight: 0.065 ounces, 1.859grams.
0.100(2.54)
0.100(2.54)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
PA RA M E TE R
Ma xi mum Re c ur r e nt P e a k Re ve r s e Vo lta g e
Ma xi mum RMS Vo lta g e
Ma xi mum D C B lo c k i ng Vo lta g e
Ma xi mum A ve r a g e F o r wa r d C ur r e nt a t Tc = 7 5
O
S YMB O L
V
RRM
V
RMS
V
DC
C
I
F (AV )
I
F S M
V
F
I
R
R
JC
T
J
T
S TG
SB 2020C T S B2030C T S B2040C T SB2045C T SB2050C T SB 2060C T
UNITS
V
V
V
A
20
14
20
30
21
30
40
28
40
2 0 .0
45
31
45
50
35
50
60
42
60
P e a k F o r wa r d S ur g e C ur r e nt :8 .3 m s s i ng le ha lf
s i ne - wa ve s up e r i mp o s e d o n r a te d lo a d
(J E D E C m e tho d )
Ma xi mum F o r wa r d Vo lta g e a t 1 0 A
p e r le g
T
J
=2 5
O
C
T
J
=1 0 0
O
C
200
A
0 .5 5
0 .2
50
2
- 5 5 to + 1 2 5
- 5 5 to + 1 5 0
- 5 5 to +1 5 0
0 .7 5
V
Ma xi mum D C Re ve r s e C ur r e nt a t Ra te d
D C B lo c k i ng Vo lta g e
Typ i c a l The r ma l Re s i s ta nc e
Op e ra ti ng J unc ti o n Te m p e r a tur e Ra ng e
S to r a g e Te mp e r a ture Ra ng e
mA
O
C / W
O
C
C
O
Note:
Both Bonding and Chip structure are available.
August 25,2010-REV.04
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