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PJD13N10A_L2_00001

Description
Power Field-Effect Transistor
CategoryDiscrete semiconductor    The transistor   
ManufacturerPANJIT
Websitehttp://www.panjit.com.tw/

PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values ​​include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.

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PJD13N10A_L2_00001 Overview

Power Field-Effect Transistor

PJD13N10A_L2_00001 Parametric

Parameter NameAttribute value
MakerPANJIT
package instructionSMALL OUTLINE, R-PSSO-G2
Reach Compliance Codecompliant
Other featuresULTRA LOW RESISTANCE
Avalanche Energy Efficiency Rating (Eas)6.1 mJ
ConfigurationSINGLE WITH BUILT-IN DIODE
Minimum drain-source breakdown voltage100 V
Maximum drain current (ID)2.9 A
Maximum drain-source on-resistance0.115 Ω
FET technologyMETAL-OXIDE SEMICONDUCTOR
JEDEC-95 codeTO-252AA
JESD-30 codeR-PSSO-G2
Number of components1
Number of terminals2
Operating modeENHANCEMENT MODE
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Polarity/channel typeN-CHANNEL
Maximum pulsed drain current (IDM)52 A
surface mountYES
Terminal formGULL WING
Terminal locationSINGLE
Transistor component materialsSILICON

PJD13N10A_L2_00001 Preview

Download Datasheet
PPJD13N10A
100V N-Channel Enhancement Mode MOSFET
Voltage
Features
100 V
Current
13A
R
DS(ON) ,
V
GS
@10V, ID@6.5A<115mΩ
R
DS(ON)
, V
GS
@4.5V, ID@4A<120mΩ
Advanced Trench Process Technology
High density cell design for ultra low on-resistance
Lead free in compliance with EU RoHS 2011/65/EU
directive
Green molding compound as per IEC61249 Std..
(Halogen Free)
TO-252AA
Mechanical Data
Case: TO-252AA Package
Terminals: Solderable per MIL-STD-750, Method 2026
Approx. Weight: 0.0104 ounces, 0.297 grams
Maximum Ratings and Thermal Characteristics
(T
A
=25 C unless otherwise noted)
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current
Power Dissipation
Continuous Drain Current
Power Dissipation
(Note 1)
o
SYMBOL
V
DS
V
GS
LIMIT
UNITS
V
V
A
100
+20
13
8
52
41
16
2.9
2.3
2.0
1.3
6.1
-55~150
3.05
62.5
o
T
C
=25
o
C
T
C
=100 C
T
C
=25 C
T
C
=25
o
C
T
C
=100
o
C
T
A
=25
o
C
T
A
=70
o
C
T
A
=25
o
C
T
A
=70
o
C
o
o
I
D
I
DM
P
D
I
D
P
D
E
AS
T
J
,T
STG
R
θJC
R
θJA
W
A
A
W
mJ
o
Single Pulse Avalanche Energy
(Note 6)
Operating Junction and Storage Temperature Range
Typical Thermal Resistance
(Note 4,5)
C
Junction to Case
Junction to Ambient
C/W
Limited only By Maximum Junction Temperature
July 26,2016-REV.01
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