MMSZ5226B_R1_00001 datasheet, PDF

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MMSZ5226B_R1_00001: DescriptionAccuracy: - Voltage regulation value (typ.): 3.3V Reverse leakage current: 25uA @ 1V Maximum power: 500mW; CategoryDiscrete semiconductor diode; File Size378KB，6 Pages; ManufacturerPANJIT; Websitehttp://www.panjit.com.tw/; Environmental Compliance; PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.

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MMSZ5226B_R1_00001 Overview

Accuracy: - Voltage regulation value (typ.): 3.3V Reverse leakage current: 25uA @ 1V Maximum power: 500mW

MMSZ5226B_R1_00001 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	PANJIT
package instruction	R-PDSO-G2
Reach Compliance Code	compliant
ECCN code	EAR99
Configuration	SINGLE
Diode component materials	SILICON
Diode type	ZENER DIODE
JESD-30 code	R-PDSO-G2
JESD-609 code	e3
Number of components	1
Number of terminals	2
Maximum operating temperature	150 °C
Minimum operating temperature	-55 °C
Package body material	PLASTIC/EPOXY
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
polarity	UNIDIRECTIONAL
Maximum power dissipation	0.5 W
Nominal reference voltage	3.3 V
surface mount	YES
technology	ZENER
Terminal surface	Tin (Sn)
Terminal form	GULL WING
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
Maximum voltage tolerance	4.99%
Working test current	20 mA

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MMSZ5221B~MMSZ5262B

SURFACE MOUNT SILICON ZENER DIODES

VOLTAGE

2.4 to

Volt

POWER

500 mWatt

0.154(3.90)

0.141(3.60)

0.110(2.80)

0.098(2.50)

FEATURES

• Planar Die construction

• 500mW Power Dissipation

• Ideally Suited for Automated Assembly Processes

• Lead free in compliance with EU RoHS 2.0

• Green molding compound as per IEC 61249 standard

0.028(0.70)

0.019(0.50)

0.071(1.80)

0.055(1.40)

MECHANICAL DATA

• Case: SOD-123, Molded Plastic

• Terminals: Solderable per MIL-STD-750, Method 2026

• Approx. Weight: 0.0003 ounce, 0.0103 gram

0.008(0.20)MAX.

0.053(1.35)

0.037(0.95)

0.016(0.40)MIN.

0.005(0.12)MAX.

Cathode

Anode

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Parameter

Total Power Dissipation (Notes A)

Typical Thermal Resistance (Notes B)

(Notes A)

Operating Junction and StorageTemperature Range

Symbol

Value

500

430

325

-55 to +150

Units

C/W

NOTES : A. Mounted on 100cm

(1mm thick) copper areas.

B. Mounted on a FR4 PCB, single-sided copper, mini pad.

December 13,2017-REV.08

PAGE . 1

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