MMSZ5221BS datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Discrete semiconductor> MMSZ5221BS

Preview

MMSZ5221BS: DescriptionZener diode; CategoryDiscrete semiconductor; File Size971KB，2 Pages; ManufacturerJCET; Websitehttp://www.cj-elec.com/; Jiangsu Changdian Technology Co., Ltd. focuses on semiconductor packaging and testing business, providing customers at home and abroad with a full range of solutions such as chip testing, packaging design, packaging testing, etc. The company was successfully listed on the Shanghai Main Board in 2003, becoming the first semiconductor packaging and testing listed company in China. It now has a national enterprise technology center and a postdoctoral research workstation. It is a national key high-tech enterprise, a supporting unit of the National Engineering Laboratory for High-density Integrated Circuits, and the chairman unit of the Integrated Circuit Packaging Technology Innovation Strategic Alliance.

Discrete devices: diodes (switching diodes, Schottky diodes (Schottky rectifiers), voltage regulator diodes, Pin diodes, TVS diodes, rectifier diodes, fast recovery diodes); transistors (Darlington tubes, digital transistors, MOSFETs); thyristors: silicon-controlled rectifiers, triacs; composite tubes: transistors + field-effect tubes, dual transistors, dual digital transistors, digital transistors + transistors, transistors + diodes, field-effect tubes + diodes, dual field-effect tubes. Voltage regulator circuit; energy-saving lamp charger switch tube

Lead frame: TO series (TO); SOD series (SOD); SOT series (TSOT, SOT); FBP series (WBFBP); QFN series (QFNWB, DFNWB, DFNFC, QFNFC); QFP series (LQFP: PQFP: PLCC: TQFP); SIP series (SIP, HSIP, FSIP); SOP series (SOP, HSOP, SSOP, MSOP, HTSOP, TSSOP); DIP series (DIP, FDIP, SDIP); PDFN series; PQFN series; MIS series (MISFC, MISWB)

Nine core technologies: Through Silicon Via (TSV) packaging technology; SiP RF packaging technology; wafer-level 3D rewiring packaging process technology; copper bump interconnection technology; high-density FC-BGA packaging and testing technology (Flip Chip BGA); multi-turn array four-sided pinless packaging and testing technology; package body 3D stacking technology; 50μm or less ultra-thin chip 3D stacking packaging technology; MEMS multi-chip packaging technology; MIS packaging technology (pre-encapsulated interconnection system); BGA packaging technology, etc.

Download Datasheet View All

MMSZ5221BS Overview

Zener diode

Features

Product Name: Zener Diode

Product model: MMSZ5221BS

product features:

Planar Die Construction

Ultra-Small Surface Mount Package

General purpose, Medium Current

Ideally Suited for Automated Assembly Processes

Product parameters:

Pd power dissipation: 200mW

Vz stable voltage: Nom=2.4V Min=2.28V Max=2.52V

Zzt breakdown impedance: 30Ω

Zzk breakdown impedance: 1200Ω

IR reverse current: 100uA

Vf forward voltage drop: 0.9V

Package: SOD-323

MMSZ5221BS Preview

Download Datasheet

View All

JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD

SOD-323 Plastic-Encapsulate Diode

MMSZ5221BS-MMSZ5259BS

ZENER DIODE

FEATURES

• Planar Die Construction

• Ultra-Small Surface Mount Package

• General purpose, Medium Current

• Ideally Suited for Automated Assembly Processes

SOD-323

Maximum Ratings(T

=25℃ unless otherwise specified)

Characteristic

Forward Voltage (Note 2)

Power Dissipation(Note 1)

Thermal Resistance, Junction to Ambient Air

Operating and Storage Temperature Range

@ I

= 10mA

Symbol

θJA

STG

Value

0.9

200

625

-65

+150

Unit

℃/W

℃

Notes:1. Device mounted on ceramic PCBS; 7.6 mm x 9.4 mm x 0.87 mm with pad areas 25 mm .

2. Tested with pulses, Tp≤1.0ms.

A,Jun,2011

Recommended Resources

CD4069 circuit

TDA7245 power amplifier circuit diagram

Two active two-way power amplifier circuits 01

Telephone ringing detection circuit

Micropower field strength detection circuit

555 train lighting automatic switch circuit

Low-cost Wemos W600-PICO development board: Wemos W600-PICO WiFi IoT development board, comes with micropython firmware, priced at $2.1. It is the same chip as the TB-01 W600 recommended in previous community activities, and is similar to ESP82...; dcexpert MicroPython Open Source section

EEWORLD University Hall----American DIY players comprehensively test Keithley 2280S high measurement accuracy power supply: American DIY players comprehensively tested Keithley 2280S high measurement accuracy power supply : https://training.eeworld.com.cn/course/4776DIY expert unboxes and reviews Keithley 2280S high measur...; 量子阱 Integrated technical exchanges

Today at 10:00 AM, live broadcast with prizes: Melexis explains the implementation and technical support of semiconductor R&D functional safety: Today at 10:00 AM, live broadcast with prizes: Melexis explains the implementation and technical support of semiconductor RD functional safetyClick here to enter the live broadcastLive broadcast time:...; EEWORLD社区 Automotive Electronics

Writing and running Python in the browser: [i=s]This post was last edited by dcexpert on 2022-6-10 10:04[/i]iRobot Education supports writing and running Python in a web browser. This requires a browser with a chrome kernel and webbluetooth su...; dcexpert MicroPython Open Source section

Technology Classroom | Cortex-M Architecture MCU Relocation Vector Table: The Cortex-M architecture uses a "vector table lookup mechanism". When an exception occurs, the kernel will automatically find the entry address of the handler from the vector table. The vector table ...; MamoYU Real-time operating system RTOS

The voltage comparator outputs a negative value, why?: The voltage comparator outputs square waves that are all negative. How can I change them to positive values?...; @海风 Analogue and Mixed Signal

Popular Components