HR8P296FLLV datasheet, PDF - EEWORLD Datasheet

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HR8P296FLLV: DescriptionLQFP80, 128Kx8-bit FLASH ROM, 12K×8-bit RAM (KB), 33MHz, -40℃ ~ 85℃, 2.5V ~ 5.5V; CategoryMicro - MCU controller; File Size3MB，250 Pages; ManufacturerEastSoft; Websitehttp://www.ichaier.com/; Shanghai Neusoft Carrier Microelectronics Co., Ltd. (formerly Shanghai Haier Integrated Circuit Co., Ltd.) has been focusing on chip design for 15 years. It was acquired by Neusoft Carrier in 2015. After years of hard work, it has mastered core technologies with independent intellectual property rights and has achieved fruitful results in design process, product architecture, behavioral level description, RTL level design, verification, layout and home appliance control board design.

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HR8P296FLLV Overview

LQFP80, 128Kx8-bit FLASH ROM, 12K×8-bit RAM (KB), 33MHz, -40℃ ~ 85℃, 2.5V ~ 5.5V

HR8P296FLLV Parametric

Parameter Name	Attribute value
Product number	HR8P296FLLV
Encapsulation	LQFP80
I/O	72
FLASH ROM	128Kx8bit
RAM(KB)	12K×8 bits
Maximum operating frequency	33MHz
Operating temperature	-40℃ ~ 85℃
Operating Voltage	2.5V ~ 5.5V
Timer 16 bit	4
Timer 32 bit	3
RTC	1
motor control	-
UART	6
IIC	1
SPI	1
IIS	-
USB	-
CAN	-
SDIO	-
Ethernet MAC10/100	-
FSMC	-
Number of digits	12
Number of channels	11
DAC	-
Operational Amplifier	-
Analog comparator	-
Internal reference voltage	YES
Touch button channel	-
LCD	8x56
lowest power mode	-
special function	With EUART

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HR8P296

数据手册

MCU

HR8P296

数据手册

ARM Cortex

-M0

内核



产品简介



数据手册

产品规格

上海东½½½波微电子有限公司

2020

年

月

日

V1.6

1/250

http://www.essemi.com

HR8P296

数据手册

目½

内容目½

第

章

1. 1

1. 2

1. 3

1. 4

芯片简介

................................................................................................................... 13

概述

.......................................................................................................................... 13

应用领域

................................................................................................................... 15

结构框图

................................................................................................................... 16

管脚图

....................................................................................................................... 17

1. 4. 1 LQFP80

封装图

................................................................................................. 17

1. 4. 2 LQFP64

封装图

................................................................................................. 18

管脚说明

................................................................................................................... 19

管脚复用

................................................................................................................... 20

1. 6. 1 PA

管脚复用

...................................................................................................... 20

1. 6. 2 PB

管脚复用

...................................................................................................... 21

1. 6. 3 PC

管脚复用

...................................................................................................... 22

系统控制及操½特性

................................................................................................. 23

系统控制保护

............................................................................................................ 23

2. 1. 1

概述

............................................................................................................ 23

2. 1. 2

特殊功½寄存器..........................................................................................

系统电源

................................................................................................................... 23

2. 2. 1

结构框图

.................................................................................................... 23

2. 2. 2

芯片供电电源

............................................................................................. 24

2. 2. 3

芯片内部

3.0V

稳压输出

VR30................................................................... 24

2. 2. 4

芯片内部

3.6V

稳压输出

VR36................................................................... 24

2. 2. 5

特殊功½寄存器..........................................................................................

系统复½

................................................................................................................... 25

2. 3. 1

概述

............................................................................................................ 25

2. 3. 2

结构框图

.................................................................................................... 25

2. 3. 3

复½时序图

................................................................................................. 25

2. 3. 4

外部复½

MRSTN

参考

.............................................................................. 26

2. 3. 5

特殊功½寄存器..........................................................................................

½电压监测（LVD）

................................................................................................. 28

2. 4. 1

概述

............................................................................................................ 28

2. 4. 2

特殊功½寄存器..........................................................................................

系统½功耗操½模式

................................................................................................. 30

2. 5. 1

概述

............................................................................................................ 30

2. 5. 2

睡眠模式

.................................................................................................... 30

2. 5. 3

深度睡眠模式

............................................................................................. 30

2. 5. 4

唤醒方式

.................................................................................................... 31

2. 5. 5

唤醒时间

.................................................................................................... 31

2. 5. 6

FLASH

存储器等待功½

............................................................................. 31

2. 5. 7

特殊功½寄存器..........................................................................................

系统时钟

................................................................................................................... 32

2. 6. 1

时钟源概述

................................................................................................. 32

2. 6. 2

结构框图

.................................................................................................... 32

2. 6. 3

时钟源

........................................................................................................ 32

2. 6. 4

系统时钟源切换..........................................................................................

2. 6. 5

系统时钟分频

............................................................................................. 34

2. 6. 6

外设模块时钟配½

...................................................................................... 34

2. 6. 7

特殊功½寄存器..........................................................................................

5/250

http://www.essemi.com

1. 5

1. 6

第

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2. 1

2. 2

2. 3

2. 4

2. 5

2. 6

V1.6

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