Junction Temperature ........................................................................................................................................ 150
°C
Maximum
•
Maximum Power Dissipation
Total Power Dissipation (T
C
=25°C)....................................................................................................................................... 40 W
•
Maximum Voltages and Currents (T
A
=25°C)
V
CBO
Collector to Base Voltage............................................................................................................................................ 700 V
V
CEO
Collector to Emitter Voltage ........................................................................................................................................ 400 V
V
EBO
Emitter to Base Voltage................................................................................................................................................... 9 V
I
C
Collector Current (Continuous) ......................................................................................................................................... 1.5 A
I
B
Base Current (Continuous) ............................................................................................................................................. 0.75 A
Electrical Characteristics
(T
A
=25°C)
Characteristic
Breakdown Collector-Base Voltage
Breakdown Collector-Emitter Voltage
Emitter Cut-off Current
Collector Cut-off Current
Symbol
BV
CBO
BV
CEO
I
EBO
I
CEX
*V
CE(sat)1
Collector-Emitter Saturation Voltage
*V
CE(sat)2
*V
CE(sat)3
Base-Emitter Saturation Voltage
*V
BE(sat)
*V
BE(sat)
DC Current Gain
*h
FE1
*h
FE2
Min.
700
400
-
-
-
-
-
-
-
8
5
Typ.
-
-
-
-
-
-
-
-
-
-
-
Max.
-
-
1
1
500
1
3
1
1.2
40
25
Unit
V
V
mA
mA
mV
V
V
V
V
I
C
=1mA
I
C
=10mA
V
EB
=9V
V
CE
=700V, V
BE(off)
=1.5V
I
C
=0.5A, I
B
=0.1A
I
C
=1A, I
B
=0.25A
I
C
=1.5A, I
B
=0.5A
I
C
=0.5A, I
B
=0.1A
I
C
=1A, I
B
=0.25A
I
C
=0.3A, V
CE
=5V
I
C
=1A, V
CE
=5V
*Pulse Test: Pulse Width
≤380us,
Duty Cycle≤2%
Test Conditions
HMJE13003D
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
100
Spec. No. : HD200207
Issued Date : 1993.04.12
Revised Date : 2007.09.04
Page No. : 2/5
Saturation Voltage & Collector Current
1000
V
CE(s at)
@ I
C
=3I
B
125 C
o
75 C
o
Saturation Voltage (mV)
75 C
o
25 C
o
hFE
10
100
125 C
o
hFE @ V
CE
=5V
25 C
o
1
0.1
1
10
100
1000
10000
10
1
10
100
1000
10000
Collector Current-I
C
(mA)
Collector Current-I
C
(mA)
Saturation Voltage & Collector Current
10000
V
CE(sat)
@ I
C
=4I
B
10000
Saturation Voltage & Collector Current
V
CE(sat)
@ I
C
=5I
B
Saturation Voltage (mV)
1000
75 C
125 C
100
o
o
Saturation Vpltage (mV)
1000
75 C
125 C
100
25 C
o
o
o
25 C
o
10
1
10
100
1000
10000
10
1
10
100
1000
10000
Collector Current-I
C
(mA)
Collector Current-I
C
(mA)
Saturation Voltage & Collector Current
10000
V
BE(sat)
@ I
C
=4I
B
10000
Saturation Voltage & Collector Current
V
BE(s at)
@ I
C
=5I
B
Saturation Voltage (mV)
Saturation Voltage (mV)
75 C
1000
25 C
o
o
75 C
1000
25 C
o
o
125 C
o
125 C
o
100
1
10
100
1000
10000
100
1
10
100
1000
10000
Collector Current-I
C
(mA)
Collector Current-I
C
(mA)
HMJE13003D
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Safe Operating Area
10000
Spec. No. : HD200207
Issued Date : 1993.04.12
Revised Date : 2007.09.04
Page No. : 3/5
PT=1mS
Collector Current (mA)
1000
PT=10mS
PT=1S
100
10
1
10
100
1000
Forward Voltage-V
CE
(V)
HMJE13003D
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-126ML Dimension
A
C
D
E
Marking:
Spec. No. : HD200207
Issued Date : 1993.04.12
Revised Date : 2007.09.04
Page No. : 4/5
L
Pb Free Mark
H
MJ E
13003
Date Code
Pb-Free: "
.
"
(Note)
Normal: None
I
B
1
F
H
G
M
2
3
Control Code
Note: Green label is used for pb-free packing
Pin Style: 1.Base 2.Collector 3.Emitter
Material:
•
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
•
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM
A
B
C
D
E
F
G
H
I
J
K
L
M
N
Min.
7.74
10.87
0.88
1.28
3.50
2.61
13
1.18
2.88
0.68
-
3.44
1.88
0.50
Max.
8.24
11.37
1.12
1.52
3.75
3.37
-
1.42
3.12
0.84
2.30
3.70
2.14
0.51
*: Typical, Unit: mm
K
J
N
3-Lead TO-126ML
Plastic Package
HSMC Package Code: D
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
•
Head Office
(Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056
Fax: 886-2-25632712, 25368454
•
Factory 1:
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HMJE13003D
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Soldering Methods for HSMC’s Products
1. Storage environment: Temperature=10 C~35 C Humidity=65%±15%
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