The HBAV70 consists of two diodes in a plastic surface mount package. The diodes are connected in series and the unit is designed for high-speed switching application in hybrid thick and thin-film circuits.
The HBAV70 consists of two diodes in a plastic surface mount package. The
diodes are connected in series and the unit is designed for high-speed switching
application in hybrid thick and thin-film circuits.
Diagram:
SOT-23
Features
•
Small SMD Package (SOT-23)
•
Ultra-high Speed
•
Low Forward Voltage
•
Fast Reverse Recovery Time
Absolute Maximum Ratings
•
Maximum Temperatures
Storage Temperature ........................................................................................................................... -65 ~ +150
°C
Junction Temperature .................................................................................................................................... +150
Reverse Voltage.................................................................................................................................................. 70 V
Forward Current............................................................................................................................................. 200 mA
Repetitive Forward Current............................................................................................................................ 500 mA
Electrical Characteristics
(T
A
=25°C)
Characteristic
Reverse Breakdown Voltage
Symbol
V
(BR)
V
F(1)
Forward Voltage
V
F(2)
V
F(3)
V
F(4)
Reverse Current
Total Capacitance
Reverse Recovery Time
I
R
C
T
T
rr
I
R
=100uA
I
F
=1mA
I
F
=10mA
I
F
=50mA
I
F
=100mA
V
R
=70
V
R
=0, f=1MHz
I
F
=I
R
=10mA, R
L
=100Ω, measured at
I
R
=1mA, V
R
=5V
Condition
Min
70
-
-
-
-
-
-
-
Max
-
715
855
1100
1300
5
1.5
15
Unit
V
mV
mV
mV
mV
uA
pF
nS
HBAV70
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Forward Biased Voltage & Forward Current
450
Spec. No. : HE6801
Issued Date : 1995.11.17
Revised Date : 2004.08.26
Page No. : 2/4
Capacitance & Reverse-Biased Voltage
1
300
150
0
0
500
1000
1500
2000
Capacitance-Cd (pF)
0.1
0.1
Current-I
F
(mA)
Forward Biased Voltage-VF (mV)
1
10
Reverse-Biased Voltage-V
R
(V)
100
HBAV70
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-23 Dimension
Marking:
A
L
Spec. No. : HE6801
Issued Date : 1995.11.17
Revised Date : 2004.08.26
Page No. : 3/4
A
3
4
Pb Free Mark
Pb-Free: " "
(Note)
Normal: None
B S
1
2
Note: Pb-free product can distinguish by the green
label or the extra description on the right
side of the label.
Pin Style: 1.Anode 2.Anode 3.Cathode
Material:
•
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
•
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
V
G
DIM
A
B
C
D
G
H
J
K
L
S
V
Min.
2.80
1.20
0.89
0.30
1.70
0.013
0.085
0.32
0.85
2.10
0.25
Max.
3.04
1.60
1.30
0.50
2.30
0.10
0.177
0.67
1.15
2.75
0.65
*: Typical, Unit: mm
C
D
H
3-Lead SOT-23 Plastic
Surface Mounted Package
HSMC Package Code: N
K
J
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
•
Head Office
(Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
•
Factory 1:
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
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