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GS2MIF_R2_00001

Description
Rectifier Diode, 1 Phase, 1 Element, 2A, 1000V V(RRM), Silicon, SMAF, 2 PIN
CategoryDiscrete semiconductor    diode   
ManufacturerPANJIT
Websitehttp://www.panjit.com.tw/
Environmental Compliance

PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values ​​include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.

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GS2MIF_R2_00001 Overview

Rectifier Diode, 1 Phase, 1 Element, 2A, 1000V V(RRM), Silicon, SMAF, 2 PIN

GS2MIF_R2_00001 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerPANJIT
package instructionSMAF, 2 PIN
Reach Compliance Codenot_compliant
ECCN codeEAR99
applicationGENERAL PURPOSE
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeRECTIFIER DIODE
Maximum forward voltage (VF)1.1 V
JESD-30 codeR-PDSO-F2
Maximum non-repetitive peak forward current60 A
Number of components1
Phase1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Maximum output current2 A
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Maximum repetitive peak reverse voltage1000 V
Maximum reverse current1 µA
surface mountYES
Terminal formFLAT
Terminal locationDUAL
Base Number Matches1

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GS2GIF SERIES
SURFACE MOUNT RECTIFIER
VOLTAGE
FEATURES
• For surface mounted applications in order to optimize board space
• Easy pick and place
• Plastic package has Underwriters Laboratory Flammability
Classification 94V-O
• Low Forward Drop
o
• High temperature soldering : 260 C/10 seconds at terminals
• Glass Passivated Chip Junction
• Ultra Thin Profile Package for Space Constrained Utilization
• Package suitable for Automated Handling
• Lead free in comply with EU RoHS 2011/65/EU directives.
• Green molding compound as per IEC61249 Std. . (Halogen Free)
400~1000 Volts
CURRENT
2 Ampere
MECHANICAL DATA
• Case: SMAF molded plastic
• Terminals: Solder plated, solderable per MIL-STD-750,Method 2026
• Polarity : Color band denotes cathode end
1
2
Cathode
Anode
o
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T
A
=25 C unless otherwise noted)
PA RA M E TE R
Re c urr e nt P e a k Re ve r s e Vo lta g e
RMS Vo lt a g e
D C B lo c k i ng Vo lta g e
A ve ra g e F o r wa rd C urre nt
P e a k F o rwa r d S ur g e C ur re nt : 8 . 3 m s s i ng le ha lf s i ne -wa ve
s up e ri mp o s e d o n ra t e d lo a d ( J E D E C m e tho d )
F o r wa rd Vo lt a g e a t 2 A
D C Re ve rs e C urr e nt a t Ra t e d
D C B lo c k i ng Vo lta g e
Typ i c a l J unc t i o n C a p a c i t a nc e
S YMB OL
V
RRM
V
RM S
V
R
I
F (AV )
I
F S M
V
F
GS 2 GIF GS 2 J IF
400
280
400
600
420
600
2
GS 2 K IF GS 2 M IF
800
560
800
1000
700
1000
UNITS
V
V
V
A
A
V
60
1 .1
T
J
= 2 5
O
C
I
R
1
A
V
R
= 4 V,1 M H
Z
C
J
R
J
L
R
J
A
T
J
,T
S TG
15
25
150
-5 5 to + 1 5 0
O
pF
C / W
O
Typ i c a l The r ma l Re s i s ta nc e , J unc ti o n to L e a d (No t e 1 )
J unc t i o n t o A m b i e nt (No t e 2 )
Op e r a ti ng J unc t i o n Te mp e r a tur e a nd S t o r a g e Te mp e ra t ur e Ra ng e
C
NOTES :
1.Mounted on an FR4 PCB, single-sided copper, with 100cm
2
copper pad area.
2.Mounted on an FR4 PCB, single-sided copper, mini pad.
June 18,2013-REV.00
PAGE . 1
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