GQZ27D_R2_10001 datasheet, PDF

Datasheet> All Categories > Discrete semiconductor> diode> GQZ27D_R2_10001

GQZ27D_R2_10001: DescriptionZener Diode,; CategoryDiscrete semiconductor diode; File Size128KB，6 Pages; ManufacturerPANJIT; Websitehttp://www.panjit.com.tw/; Environmental Compliance; PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.

Download Datasheet Parametric View All

GQZ27D_R2_10001 Overview

Zener Diode,

GQZ27D_R2_10001 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	PANJIT
package instruction	O-LELF-R2
Reach Compliance Code	compliant
ECCN code	EAR99
Shell connection	ISOLATED
Configuration	SINGLE
Diode component materials	SILICON
Diode type	ZENER DIODE
JESD-30 code	O-LELF-R2
JESD-609 code	e3
Number of components	1
Number of terminals	2
Maximum operating temperature	175 °C
Package body material	GLASS
Package shape	ROUND
Package form	LONG FORM
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
polarity	UNIDIRECTIONAL
Maximum power dissipation	0.5 W
Nominal reference voltage	27 V
surface mount	YES
technology	ZENER
Terminal surface	Tin (Sn)
Terminal form	WRAP AROUND
Terminal location	END
Maximum time at peak reflow temperature	NOT SPECIFIED
Maximum voltage tolerance	2.5%
Working test current	5 mA
Base Number Matches	1

GQZ27D_R2_10001 Preview

Download Datasheet

View All

GQZ2.0~GQZ56

SURFACE MOUNT ZENER DIODES

VOLTAGE

2 to 56 Volts

POWER

500 mWatts

FEATURES

• Planar Die construction

• 500mW Power Dissipation

0.055(1.4)DIA.

• Ideally Suited for Automated Assembly Processes

• Lead free in comply with EU RoHS 2002/95/EC directives

MECHANICAL DATA

• Case: Molded Glass QUADRO-MELF

• Terminals: Solderable per MIL-STD-750, Method 2026

• Approx. Weight: 0.03 grams

• Mounting Position: Any

• Packing information

T/R - 2.5K per 7" plastic Reel

0.020(0.5)

0.012(0.3)

0.146(3.7)

0.130(3.3)

0.020(0.5)

0.012(0.3)

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Parameter

Power Dissipation at T

= 25

Junction Temperature Range

Storage Temperature Range

Symbol

Value

500

175

-65 to + 175

Units

TOT

STG

Valid provided that leads at a distance of 10mm from case are kept at ambient temperature.

Parameter

Thermal Resistance Junction to Ambient Air

Forward Voltage at I

= 100mA

Symbol

Min.

Typ.

Max.

0.3

Units

C/mW

Valid provided that leads at a distance of 10mm from case are kept at ambient temperature.

April 11,2012-REV.01

0.063(1.6)

PAGE . 1

Recommended Resources

Manual temperature control circuit 2

Field effect grid-cathode video amplifier circuit

High Stability 1A Voltage Regulator Circuit

Circuit diagram of square wave generator with adjustable duty cycle composed of 555

Analog voltage divider circuit for wideband X input

Dual tone dial phone lock zero circuit circuit diagram

Ten key points about GaN: No time? Start here! This quick list summarizes the main points of the book. Read the main points of this chapter, and if there are any that interest you, check out the full explanations in the previo...; 兰博 RF/Wirelessly

QCA9531+QCA9887 Series Embedded Dual-Band AP Module Selection Reference: In the field of security, the traditional transmission in the network field is through wired networks. The current popular way is to use WiFi wireless network. The embedded interfaces include RJ-45, U...; natertech Security Electronics

Taking the route of "surrounding the city from the countryside"? What do you think about Hongmeng system? ? ?: Today, I saw a group of netizens chatting about the Hongmeng system in a development group.Start with a picture, then start chattingMartian netizens analyzed: This means that Hongmeng has integrated b...; okhxyyo Embedded System

Communication problem between CC2541 and Bluetooth module: We are going to make a Bluetooth remote control using CC2541 to communicate with the Bluetooth module on another board.The Bluetooth slave module selected is DX-BT19-S. I can't write. I asked the deve...; chenbingjy Wireless Connectivity

[RTT & Renesas high performance CPK-RA6M4] 4. SPI drive OLED evaluation: [i=s]This post was last edited by kit7828 on 2022-6-2 10:34[/i]1. Development board hardware functions and peripherals introduction From the description of SPI in the hardware manual of Renesas RA6M4,...; kit7828 Renesas Electronics MCUs

How can I quantify the change in resistance value due to the heat generated by the circuit?: The potentiometer I use has a resistance range of 0~50Ω and a temperature coefficient of 100ppm/℃. It is generally powered on for 24 hours under working conditions, and the working current is calculat...; blue777777 PCB Design

Popular Components