GD32F190R6T6 datasheet, PDF - EEWORLD Datasheet

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GD32F190R6T6: DescriptionARM® Cortex®-M3 32-bit MCU, Max Speed (MHz): 72; Memory (Bytes) Flash: 32K; Memory (Bytes) SRAM: 6K; I/O: up to 55; Timer GPTM (32bit): 1; Timer GPTM (16bit): 5; Timer Advanced TM (16bit): 1; Timer Basic TM (16bit): 1; Timer SysTick (24bit): 1; Timer WDG: 2; Timer RTC: 1; Connectivity USART: 2; Connectivity I2C: 1; Connectivity SPI: 1; Connectivity I2S: 1; Connectivity Comp: 2; Analog Interface 12bit ADC Units (CHs): 1(16); Analog Interface 12bit DAC Units: 2; Package: LQFP64; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，59 Pages; ManufacturerGigaDevice; Websitehttp://www.gigadevice.com; Founded in Silicon Valley in 2005, GigaDevice is a leading fabless semiconductor company dedicated to providing advanced storage technologies and IC solutions. The company successfully completed its IPO on the Shanghai Stock Exchange in 2016. GigaDevice offers a wide range of high-performance flash memory and 32-bit general-purpose MCU products. It is one of the pioneers of SPI NOR flash memory and currently ranks third in the world in this market segment, with more than 1 billion units shipped annually.

Since 2007, GigaDevice has filed more than 600 patent applications and obtained more than 200 patents. More than 55% of employees are engaged in research and development, which is the basis for continuously differentiating its products from competitors in the market. The GigaDevice management team has absorbed the leading semiconductor industry experience of well-known storage companies in Silicon Valley, South Korea and Taiwan. GigaDevice has passed ISO9001 and ISO14001 certifications from DQS.

GigaDevice currently produces SPI NOR Flash, SPI NAND Flash, and MCUs for embedded, consumer, and mobile communications applications. Its manufacturing model is based on strong relationships with foundry, assembly, and test subcontractor partners. GigaDevice believes that this clearly defined fabless manufacturing model offers a competitive advantage over traditional manufacturing-based integrated device manufacturers because capital equipment expenditures to maintain advanced memory process technologies exceed market returns in many IC memory market sectors. GigaDevice's foundry partners' continued investment in advanced equipment and their rapid growth in 12" wafer capacity are key factors in its success over competitors.

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GD32F190R6T6 Overview

ARM® Cortex®-M3 32-bit MCU, Max Speed (MHz): 72; Memory (Bytes) Flash: 32K; Memory (Bytes) SRAM: 6K; I/O: up to 55; Timer GPTM (32bit): 1; Timer GPTM (16bit): 5; Timer Advanced TM (16bit): 1; Timer Basic TM (16bit): 1; Timer SysTick (24bit): 1; Timer WDG: 2; Timer RTC: 1; Connectivity USART: 2; Connectivity I2C: 1; Connectivity SPI: 1; Connectivity I2S: 1; Connectivity Comp: 2; Analog Interface 12bit ADC Units (CHs): 1(16); Analog Interface 12bit DAC Units: 2; Package: LQFP64

GD32F190R6T6 Parametric

Parameter Name	Attribute value
Parts packaging code	LQFP64
Reach Compliance Code	unknown
Is Samacsys	N
Base Number Matches	1
Max Speed (MHz)	72
Memory (Bytes) Flash	32K
Memory (Bytes) SRAM	6K
I/O	up to 55
Timer GPTM (32bit)	1
Timer GPTM (16bit)	5
Timer Advanced TM (16bit)	1
Timer Basic TM (16bit)	1
Timer SysTick (24bit)	1
Timer WDG	2
Timer RTC	1
Connectivity USART	2
Connectivity I2C	1
Connectivity SPI	1
Connectivity USB 2 FS
Connectivity I2S	1
Connectivity Comp	2
Connectivity OP-AMP
Analog Interface 12bit ADC Units (CHs)	1(16)
Analog Interface 12bit DAC Units	2
Package	LQFP64

User Manual

【Manual】GD32F190R6T6 User Manual

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