GD32F130F6P6TR datasheet, PDF - EEWORLD Datasheet

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GD32F130F6P6TR: DescriptionCPU core: ARM® Cortex®-M3 Main frequency (MAX): 72MHz; CategoryThe embedded processor and controller; ManufacturerGigaDevice; Websitehttp://www.gigadevice.com; Founded in Silicon Valley in 2005, GigaDevice is a leading fabless semiconductor company dedicated to providing advanced storage technologies and IC solutions. The company successfully completed its IPO on the Shanghai Stock Exchange in 2016. GigaDevice offers a wide range of high-performance flash memory and 32-bit general-purpose MCU products. It is one of the pioneers of SPI NOR flash memory and currently ranks third in the world in this market segment, with more than 1 billion units shipped annually.

Since 2007, GigaDevice has filed more than 600 patent applications and obtained more than 200 patents. More than 55% of employees are engaged in research and development, which is the basis for continuously differentiating its products from competitors in the market. The GigaDevice management team has absorbed the leading semiconductor industry experience of well-known storage companies in Silicon Valley, South Korea and Taiwan. GigaDevice has passed ISO9001 and ISO14001 certifications from DQS.

GigaDevice currently produces SPI NOR Flash, SPI NAND Flash, and MCUs for embedded, consumer, and mobile communications applications. Its manufacturing model is based on strong relationships with foundry, assembly, and test subcontractor partners. GigaDevice believes that this clearly defined fabless manufacturing model offers a competitive advantage over traditional manufacturing-based integrated device manufacturers because capital equipment expenditures to maintain advanced memory process technologies exceed market returns in many IC memory market sectors. GigaDevice's foundry partners' continued investment in advanced equipment and their rapid growth in 12" wafer capacity are key factors in its success over competitors.

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GD32F130F6P6TR Overview

CPU core: ARM® Cortex®-M3 Main frequency (MAX): 72MHz

GD32F130F6P6TR Parametric

Parameter Name	Attribute value
CPU core	ARM® Cortex®-M3
Main frequency (MAX)	72MHz

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GigaDevice Semiconductor Inc.

GD32F130xx

ARM

Cortex

-M3 32-bit MCU

Datasheet

GD32F130xx Datasheet

Table of Contents

Table of Contents ........................................................................................................... 1

List of Figures ................................................................................................................ 3

List of Tables .................................................................................................................. 4

1. General description ................................................................................................. 5

2. Device overview ....................................................................................................... 6

2.1.

2.2.

2.3.

2.4.

2.5.

2.6.

Device information ...................................................................................................... 6

Block diagram .............................................................................................................. 7

Pinouts and pin assignment ....................................................................................... 8

Memory map .............................................................................................................. 11

Clock tree ................................................................................................................... 13

Pin definitions ............................................................................................................ 14

GD32F130R8 LQFP64 pin definitions .................................................................................. 14

GD32F130Cx LQFP48 pin definitions .................................................................................. 18

GD32F130Kx QFN32 pin definitions .................................................................................... 21

GD32F130Gx QFN28 pin definitions .................................................................................... 24

GD32F130Fx TSSOP20 pin definitions ................................................................................ 26

GD32F130xx pin alternate functions .................................................................................... 28

2.6.1.

2.6.2.

2.6.3.

2.6.4.

2.6.5.

2.6.6.

3. Functional description .......................................................................................... 31

3.1.

3.2.

3.3.

3.4.

3.5.

3.6.

3.7.

3.8.

3.9.

3.10.

3.11.

3.12.

3.13.

ARM

Cortex

-M3 core .............................................................................................. 31

On-chip memory ........................................................................................................ 31

Clock, reset and supply management ...................................................................... 31

Boot modes ................................................................................................................ 32

Power saving modes ................................................................................................. 32

Analog to digital converter (ADC) ............................................................................ 33

DMA ............................................................................................................................ 33

General-purpose inputs/outputs (GPIOs) ................................................................ 34

Timers and PWM generation ..................................................................................... 34

Real time clock (RTC) ............................................................................................ 35

Inter-integrated circuit (I2C) .................................................................................. 36

Serial peripheral interface (SPI) ............................................................................ 36

Universal synchronous asynchronous receiver transmitter (USART) ............... 36

GD32F130xx Datasheet

3.14.

3.15.

Debug mode ........................................................................................................... 37

Package and operation temperature ..................................................................... 37

4. Electrical characteristics ....................................................................................... 38

4.1.

4.2.

4.3.

4.4.

4.5.

4.6.

4.7.

4.8.

4.9.

4.10.

4.11.

4.12.

4.13.

4.14.

Absolute maximum ratings ....................................................................................... 38

Recommended DC characteristics ........................................................................... 38

Power consumption .................................................................................................. 39

EMC characteristics .................................................................................................. 40

Power supply supervisor characteristics ................................................................ 40

Electrical sensitivity .................................................................................................. 41

External clock characteristics .................................................................................. 41

Internal clock characteristics ................................................................................... 42

PLL characteristics.................................................................................................... 43

Memory characteristics ......................................................................................... 43

GPIO characteristics .............................................................................................. 43

ADC characteristics ............................................................................................... 44

SPI characteristics ................................................................................................. 44

I2C characteristics ................................................................................................. 45

5. Package information.............................................................................................. 46

5.1.

5.2.

5.3.

TSSOP package outline dimensions ........................................................................ 46

QFN package outline dimensions ............................................................................ 47

LQFP package outline dimensions .......................................................................... 49

6. Ordering information ............................................................................................. 51

7. Revision history ..................................................................................................... 52

GD32F130xx Datasheet

List of Tables

Table 2-1. GD32F130xx devices features and peripheral list

......................................................................... 6

Table 2-2. GD32F130xx memory map

................................................................................................................. 11

Table 2-3. GD32F130R8 LQFP64 pin definitions

.............................................................................................. 14

Table 2-4. GD32F130Cx LQFP48 pin definitions

.............................................................................................. 18

Table 2-5. GD32F130Kx QFN32 pin definitions

................................................................................................ 21

Table 2-6. GD32F130Gx QFN28 pin definitions

................................................................................................ 24

Table 2-7. GD32F130Fx TSSOP20 pin definitions

........................................................................................... 26

Table 2-8. Port A alternate functions summary

................................................................................................ 28

Table 2-9. Port B alternate functions summary

............................................................................................... 29

Table 2-10. Port C & D & F alternate functions summary

.............................................................................. 30

Table 4-1. Absolute maximum ratings

................................................................................................................ 38

Table 4-2. DC operating conditions

..................................................................................................................... 38

Table 4-3. Power consumption characteristics

................................................................................................ 39

Table 4-4. EMS characteristics

............................................................................................................................. 40

Table 4-5. EMI characteristics

.............................................................................................................................. 40

Table 4-6. Power supply supervisor characteristics

...................................................................................... 40

Table 4-7. ESD characteristics

............................................................................................................................. 41

Table 4-8. Static latch-up characteristics

.......................................................................................................... 41

Table 4-9. High speed crystal oscillator (HXTAL) generated from a crystal/ceramic characteristics

Table 4-10. Low speed crystal oscillator (LXTAL) generated from a crystal/ceramic characteristics

...................................................................................................................................................................................... 42

Table 4-11. Internal 8 MHz RC oscillator (IRC8M) characteristics

............................................................... 42

Table 4-12. Internal 40KHz RC oscillator (IRC40K) characteristics

............................................................ 42

Table 4-13. PLL characteristics

............................................................................................................................ 43

Table 4-14. Flash memory characteristics

........................................................................................................ 43

Table 4-15. I/O port characteristics

..................................................................................................................... 43

Table 4-16. ADC characteristics

........................................................................................................................... 44

Table 4-17. Standard SPI characteristics

........................................................................................................... 44

Table 4-18. I2C characteristics

............................................................................................................................. 45

Table 5-1. TSSOP20 package dimensions

......................................................................................................... 46

Table 5-2. QFN package dimensions

.................................................................................................................. 48

Table 5-3. LQFP package dimensions

................................................................................................................ 50

Table 6-1. Part ordering code for GD32F130xx devices

................................................................................ 51

Table 7-1. Revision history

.................................................................................................................................... 52

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