GD32F101RDT6 datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > The embedded processor and controller> Microcontrollers and processors> GD32F101RDT6

GD32F101RDT6: DescriptionARM® Cortex®-M3 32-bit MCU, Max Speed (MHz): 56; Memory (Bytes) Flash: 384K; Memory (Bytes) SRAM: 48K; I/O: up to 51; Timer GPTM (16bit): 4; Timer Basic TM (16bit): 2; Timer SysTick (24bit): 1; Timer WDG: 2; Timer RTC: 1; Connectivity I2C: 2; Connectivity SPI: 3; Analog Interface 12bit ADC Units (CHs): 1(16); Package: LQFP64; CategoryThe embedded processor and controller Microcontrollers and processors; ManufacturerGigaDevice; Websitehttp://www.gigadevice.com; Founded in Silicon Valley in 2005, GigaDevice is a leading fabless semiconductor company dedicated to providing advanced storage technologies and IC solutions. The company successfully completed its IPO on the Shanghai Stock Exchange in 2016. GigaDevice offers a wide range of high-performance flash memory and 32-bit general-purpose MCU products. It is one of the pioneers of SPI NOR flash memory and currently ranks third in the world in this market segment, with more than 1 billion units shipped annually.

Since 2007, GigaDevice has filed more than 600 patent applications and obtained more than 200 patents. More than 55% of employees are engaged in research and development, which is the basis for continuously differentiating its products from competitors in the market. The GigaDevice management team has absorbed the leading semiconductor industry experience of well-known storage companies in Silicon Valley, South Korea and Taiwan. GigaDevice has passed ISO9001 and ISO14001 certifications from DQS.

GigaDevice currently produces SPI NOR Flash, SPI NAND Flash, and MCUs for embedded, consumer, and mobile communications applications. Its manufacturing model is based on strong relationships with foundry, assembly, and test subcontractor partners. GigaDevice believes that this clearly defined fabless manufacturing model offers a competitive advantage over traditional manufacturing-based integrated device manufacturers because capital equipment expenditures to maintain advanced memory process technologies exceed market returns in many IC memory market sectors. GigaDevice's foundry partners' continued investment in advanced equipment and their rapid growth in 12" wafer capacity are key factors in its success over competitors.

Download datasheet Download User Manual Parametric View All

GD32F101RDT6 Overview

ARM® Cortex®-M3 32-bit MCU, Max Speed (MHz): 56; Memory (Bytes) Flash: 384K; Memory (Bytes) SRAM: 48K; I/O: up to 51; Timer GPTM (16bit): 4; Timer Basic TM (16bit): 2; Timer SysTick (24bit): 1; Timer WDG: 2; Timer RTC: 1; Connectivity I2C: 2; Connectivity SPI: 3; Analog Interface 12bit ADC Units (CHs): 1(16); Package: LQFP64

GD32F101RDT6 Parametric

Parameter Name	Attribute value
Parts packaging code	LQFP64
Reach Compliance Code	unknown
Is Samacsys	N
Base Number Matches	1
Max Speed (MHz)	56
Memory (Bytes) Flash	384K
Memory (Bytes) SRAM	48K
I/O	up to 51
Timer GPTM (32bit)
Timer GPTM (16bit)	4
Timer Advanced TM (16bit)
Timer Basic TM (16bit)	2
Timer SysTick (24bit)	1
Timer WDG	2
Timer RTC	1
Connectivity USART
Connectivity I2C	2
Connectivity SPI	3
Connectivity USB 2 FS
Connectivity I2S
Connectivity Comp
Connectivity OP-AMP
Analog Interface 12bit ADC Units (CHs)	1(16)
Analog Interface 12bit DAC Units
Package	LQFP64

User Manual

【Manual】GD32F101RDT6 User Manual

GD32F101RDT6 Preview

Download Datasheet

View All

GigaDevice Semiconductor Inc.

GD32F101xx

ARM

Cortex

™

-M3 32-bit MCU

Datasheet

GD32F101xx Datasheet

Table of Contents

Table of Contents ........................................................................................................... 1

List of Figures ................................................................................................................ 3

List of Tables .................................................................................................................. 4

1. General description ................................................................................................. 5

2. Device overview ....................................................................................................... 6

2.1.

2.2.

2.3.

2.4.

2.5.

2.6.

Device information ...................................................................................................... 6

Block diagram .............................................................................................................. 9

Pinouts and pin assignment ..................................................................................... 11

Memory map .............................................................................................................. 15

Clock tree ................................................................................................................... 19

Pin definitions ............................................................................................................ 20

GD32F101Zx LQFP144 pin definitions ................................................................................. 20

GD32F101Vx LQFP100 pin definitions ................................................................................ 28

GD32F101Rx LQFP64 pin definitions .................................................................................. 34

GD32F101Cx LQFP48 pin definitions .................................................................................. 38

GD32F101Tx QFN36 pin definitions .................................................................................... 41

2.6.1.

2.6.2.

2.6.3.

2.6.4.

2.6.5.

3. Functional description .......................................................................................... 43

3.1.

3.2.

3.3.

3.4.

3.5.

3.6.

3.7.

3.8.

3.9.

3.10.

3.11.

3.12.

3.13.

3.14.

ARM

Cortex™-M3 core ............................................................................................ 43

On-chip memory ........................................................................................................ 43

Clock, reset and supply management ...................................................................... 44

Boot modes ................................................................................................................ 44

Power saving modes ................................................................................................. 46

Analog to digital converter (ADC) ............................................................................ 46

DMA ............................................................................................................................ 47

General-purpose inputs/outputs (GPIOs) ................................................................ 47

Timers and PWM generation ..................................................................................... 47

Real time clock (RTC) ............................................................................................ 48

Inter-integrated circuit (I2C) .................................................................................. 48

Serial peripheral interface (SPI) ............................................................................ 49

Universal synchronous asynchronous receiver transmitter (USART) ............... 49

External memory controller (EXMC) ..................................................................... 50

GD32F101xx Datasheet

3.15.

3.16.

Debug mode ........................................................................................................... 50

Package and operation temperature ..................................................................... 50

4. Electrical characteristics ....................................................................................... 51

4.1.

4.2.

4.3.

4.4.

4.5.

4.6.

4.7.

4.8.

4.9.

4.10.

4.11.

4.12.

4.13.

4.14.

Absolute maximum ratings ....................................................................................... 51

Recommended DC characteristics ........................................................................... 51

Power consumption .................................................................................................. 52

EMC characteristics .................................................................................................. 55

Power supply supervisor characteristics ................................................................ 55

Electrical sensitivity .................................................................................................. 57

External clock characteristics .................................................................................. 58

Internal clock characteristics ................................................................................... 59

PLL characteristics.................................................................................................... 59

Memory characteristics ......................................................................................... 59

GPIO characteristics .............................................................................................. 60

ADC characteristics ............................................................................................... 61

I2C characteristics ................................................................................................. 61

SPI characteristics ................................................................................................. 61

5. Package information.............................................................................................. 63

5.1.

5.2.

QFN package outline dimensions ............................................................................ 63

LQFP package outline dimensions .......................................................................... 64

6. Ordering Information ............................................................................................. 66

7. Revision History..................................................................................................... 68

GD32F101xx Datasheet

List of Tables

Table 2-1. GD32F101xx devices features and peripheral list

.................................................................. 6

Table 2-2. GD32F101xx devices features and peripheral list (continued)

............................................. 7

Table 2-3. GD32F101xx devices features and peripheral list (continued)

............................................. 8

Table 2-4. GD32F101xx memory map

...................................................................................................... 15

Table 2-5. GD32F101Zx LQFP144 pin definitions

................................................................................... 20

Table 2-6. GD32F101Vx LQFP100 pin definitions

................................................................................... 28

Table 2-7. GD32F101Rx LQFP64 pin definitions

.................................................................................... 34

Table 2-8. GD32F101Cx LQFP48 pin definitions

.................................................................................... 38

Table 2-9. GD32F101Tx QFN36 pin definitions

....................................................................................... 41

Table 4-1. Absolute maximum ratings

..................................................................................................... 51

Table 4-2. DC operating conditions

......................................................................................................... 51

Table 4-3. Power consumption characteristics (for GD32F101x4/6/8/B devices)

............................... 52

Table 4-4. Power consumption characteristics (for GD32F101xC/D/E/F/G/I/K devices)

.................... 53

Table 4-5. EMS characteristics

................................................................................................................. 55

Table 4-6. EMI characteristics

.................................................................................................................. 55

Table 4-7. Power supply supervisor characteristics (for GD32F101x4/6/8/B devices)

....................... 55

Table 4-8. Power supply supervisor characteristics (for GD32F101xC/D/E/F/G/I/K devices)

............ 55

Table 4-9. ESD characteristics

................................................................................................................. 57

Table 4-10. Static latch-up characteristics

.............................................................................................. 57

Table 4-11. High speed external clock (HXTAL) generated from a crystal/ceramic characteristics

. 58

Table 4-12. Low speed external clock (LXTAL) generated from a crystal/ceramic characteristics

.. 58

Table 4-13. High speed internal clock (IRC8M) characteristics

............................................................ 59

Table 4-14. Low speed internal clock (IRC40K) characteristics

........................................................... 59

Table 4-15. PLL characteristics

................................................................................................................ 59

Table 4-16. Flash memory characteristics

.............................................................................................. 59

Table 4-17. I/O port characteristics (for GD32F101x4/6/8/B devices)

................................................... 60

Table 4-18. I/O port characteristics (for GD32F101xC/D/E/F/G/I/K devices)

........................................ 60

Table 4-19. ADC characteristics

............................................................................................................... 61

Table 4-20. I2C characteristics

................................................................................................................. 61

Table 4-21. Standard SPI characteristics

................................................................................................ 61

Table 5-1. QFN package dimensions

....................................................................................................... 63

Table 5-2. LQFP package dimensions

..................................................................................................... 65

Table 6-1. Part ordering code for GD32F101xx devices

........................................................................ 66

Table 7-1. Revision history

....................................................................................................................... 68

Recommended Resources

CJ20 series contactor operation indication circuit_2

Stepper Motor Driver

Electrical appliance password controller circuit

Remote control receiving and decoding component TH9738

Computer motherboard circuit diagram 820 2_06

Precautions for using LCD screen: The resolution of an LCD screen refers to the number of pixels displayed on a certain area of the LCD screen, which determines that the physical resolution of the LCD screen is fixed. LCD screens are ...; 罗姆液晶技术站 Integrated technical exchanges

Bluenrg-2N Development: I need help from all the experts. I am currently developing Bluetooth communication between bluenrg-2n. The host processor is stm32f405. Bluenrg-2n and stm32f405 use spi for communication. I am a comp...; qiyuan ST - Low Power RF

How to deal with abnormal usage of JTAG header: 1) DSP's CLKOUT has no output and does not work properly.2) Emu0 and Emu1 need to be pulled up.3) The frequency of TCK should be 10M.4) In a 3.3V DSP, the PD pin is powered by 3.3V, but the emulator n...; fish001 Microcontroller MCU

Looking for an AM receiver chip that can demodulate the aviation frequency band: Hello everyone! I want to find a demodulation chip that can demodulate aviation voice (frequency band: 118~137MHz, AM modulation), please recommend it. Thank you!!...; hhb0512 Analog electronics

Initial trial of the Pingtouge development board: HELLO WORLD output: First of all, I am very happy to get this trial opportunity of Pingtou Ge. (At the same time, I also want to complain that EEWORLD’s posts have no save function. I edited for a long time but accidenta...; luokuipeng XuanTie RISC-V Activity Zone

Made a simple scheduler on CH32V103: Thanks to Qinheng for sending me the CH32V103 evaluation board. I made a simple scheduler on which you can develop reliable applications....; yuzhang.zheng Domestic Chip Exchange

Popular Components