ES7H2023FHSD datasheet, PDF - EEWORLD Datasheet

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ES7H2023FHSD: DescriptionSOP16, 17K×16-bit FLASH ROM, 1.5K×8-bit RAM, 20MHz, -40℃ ~ 85℃, 2.2 ~ 5.5V; CategoryMicro - MCU controller; File Size3MB，225 Pages; ManufacturerEastSoft; Websitehttp://www.ichaier.com/; Shanghai Neusoft Carrier Microelectronics Co., Ltd. (formerly Shanghai Haier Integrated Circuit Co., Ltd.) has been focusing on chip design for 15 years. It was acquired by Neusoft Carrier in 2015. After years of hard work, it has mastered core technologies with independent intellectual property rights and has achieved fruitful results in design process, product architecture, behavioral level description, RTL level design, verification, layout and home appliance control board design.

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ES7H2023FHSD Overview

SOP16, 17K×16-bit FLASH ROM, 1.5K×8-bit RAM, 20MHz, -40℃ ~ 85℃, 2.2 ~ 5.5V

ES7H2023FHSD Parametric

Parameter Name	Attribute value
Product number	ES7H2023FHSD
Encapsulation	SOP16
I/O	14
FLASH ROM	17K × 16 bits
RAM(KB)	1.5K×8 bits
DATAFLASH	-
self programming	have
Maximum operating frequency	20MHz
Operating temperature	-40℃ ~ 85℃
Operating Voltage	2.2 ~ 5.5V
Internal oscillator	16MHz, 32KHz
timer 8 bits	1
Timer 12 bits	3
Timer 16 bit	2
RTC	-
UART	2
IIC	1
SPI	-
ADC bits	12
Number of ADC channels	5+2
Operational Amplifier	-
Analog comparator	-
Internal reference voltage	have
Touch button channel	12
LCD	-
special function	Up to 8 configurable high current

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ES7H2023/ ES7H2024

数据手册

MCU

ES7H2023

ES7H2024

数据手册



产品简介



数据手册



产品规格

上海东½½½波微电子有限公司

2019

年

月

日

V1.1

1/225

http://www.essemi.com

ES7H2023/ ES7H2024

数据手册

目

内容目½

第

章

1. 1

1. 2

1. 3

1. 4

第

章

2. 1

2. 2

2. 3

第

章

3. 1

3. 2

3. 3

3. 4

3. 5

3. 6

第

章

芯片简介

................................................................................................................... 13

概要

.......................................................................................................................... 13

1. 1. 1

特性

............................................................................................................ 13

选型表

........................................................................................................ 16

1. 1. 2

1. 1. 3

应用领域

.................................................................................................... 16

结构框图

................................................................................................................... 17

管脚分配图

............................................................................................................... 18

1. 3. 1

LQFP32

封装图

.......................................................................................... 18

1. 3. 2

SOP16

封装图

........................................................................................... 19

管脚说明

................................................................................................................... 20

1. 4. 1

管脚封装对照表..........................................................................................

1. 4. 2

管脚描述

.................................................................................................... 21

内核特性

................................................................................................................... 25

CPU

内核概述

.......................................................................................................... 25

硬件乘法器和硬件除法器..........................................................................................

特殊功½寄存器

........................................................................................................ 26

存储资源

................................................................................................................... 31

概述

.......................................................................................................................... 31

程序寻址空间映射

.................................................................................................... 31

FLASH

程序存储器

................................................................................................... 32

3. 3. 1

概述

............................................................................................................ 32

3. 3. 2

程序计数器（PC）

.................................................................................... 32

3. 3. 3

硬件堆栈

.................................................................................................... 33

3. 3. 4 FLASH

存储器的查表读和

IAP

操½

.................................................................. 33

3. 3. 4. 1

概述

.................................................................................................... 33

3. 3. 4. 2

FLASH

存储器的查表读

...................................................................... 34

3. 3. 4. 3

FLASH

存储器的

IAP

擦除..................................................................

3. 3. 4. 4

FLASH

存储器的

IAP

编程..................................................................

3. 3. 4. 5

特殊寄存器..........................................................................................

在线编程

ISP

和在线调试

ICD .................................................................................. 44

数据寻址空间

............................................................................................................ 45

3. 5. 1

概述

............................................................................................................ 45

3. 5. 2

数据寻址空间映射

...................................................................................... 46

3. 5. 3

通用数据存储器

SRAM .............................................................................. 46

3. 5. 4

特殊功½寄存器

SFR ................................................................................. 47

3. 5. 5

寻址方式

.................................................................................................... 50

3. 5. 5. 1

直接寻址

............................................................................................. 50

3. 5. 5. 2

GPR

特殊寻址

.................................................................................... 51

3. 5. 5. 3

间接寻址

............................................................................................. 51

特殊功½寄存器

........................................................................................................ 52

输入/输出端口

........................................................................................................... 55

5/225

http://www.essemi.com

V1.1

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