ED504YT datasheet, PDF - EEWORLD Datasheet

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ED504YT: Description5 A, 400 V, SILICON, RECTIFIER DIODE, TO-251AB; CategoryDiscrete semiconductor diode; File Size35KB，2 Pages; ManufacturerPANJIT; Websitehttp://www.panjit.com.tw/; Environmental Compliance; PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.

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ED504YT Overview

5 A, 400 V, SILICON, RECTIFIER DIODE, TO-251AB

ED504YT Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Parts packaging code	TO-251AB
package instruction	ROHS COMPLIANT, HERMETIC SEALED, PLASTIC PACKAGE-3
Contacts	3
Reach Compliance Code	_compli
Other features	LOW LEAKAGE CURRENT
application	SUPER FAST RECOVERY
Shell connection	CATHODE
Configuration	SINGLE
Diode component materials	SILICON
Diode type	RECTIFIER DIODE
Maximum forward voltage (VF)	1.25 V
JEDEC-95 code	TO-251AB
JESD-30 code	R-PSIP-T3
Maximum non-repetitive peak forward current	75 A
Number of components	1
Phase	1
Number of terminals	3
Maximum operating temperature	150 °C
Minimum operating temperature	-55 °C
Maximum output current	5 A
Package body material	PLASTIC/EPOXY
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Maximum repetitive peak reverse voltage	400 V
Maximum reverse recovery time	0.035 µs
surface mount	NO
Terminal form	THROUGH-HOLE
Terminal location	SINGLE
Maximum time at peak reflow temperature	NOT SPECIFIED
Base Number Matches	1

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ED502YT~ED506YT

SUPERFAST RECOVERY RECTIFIERS

VOLTAGE

FEATURES

• Superfast recovery times-epitaxial construction.

• Low forward voltage, high current capability.

• Exceeds environmental standards of MIL-S-19500/228.

• Hermetically sealed.

• Low leakage.

• High surge capability.

• Plastic package has Underwriters Laboratories

Flammability Classification 94V-O utilizing

Flame Retardant Epoxy Molding Compound.

• In compliance with EU RoHS 2002/95/EC directives

.264(6.7)

.248(6.3)

.098(2.5)

.082(2.1)

.024(0.6)

.016(0.4)

200 to 600 Volts

CURRENT

5.0 Amperes

TO-251AB

Unit : inch (mm)

.307(7.8)

.283(7.2)

.225(5.7)

.209(5.3)

.063(1.6)

.047(1.2)

.216(5.5)

.200(5.1)

.071(1.8)

.051(1.3)

.032(0.8)

.012(0.3)

MECHANICALDATA

• Case: Molded plastic, TO-251AB

• Terminals: Axial leads, solderable to MIL-STD-750,Method 2026

• Polarity: As marking

• Weight: 0.0104 ounces, 0.297 grams.

.02(0.5)

.09 .09

(2.3) (2.3)

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Ratings at 25°C ambient temperature unless otherwise specified.

Resistive or inductive load, 60Hz.

PA RA M E TE R

M a xi m um R e c ur r e nt P e a k R e ve r s e V o l t a g e

M a xi m um R M S V o l t a g e

M a xi m um D C B l o c k i ng V o l t a g e

M a xi m um A ve r a g e F o r w a r d C ur r e nt a t T

= 7 5

P e a k F o r w a r d S ur g e C ur r e nt : 8 . 3 m s s i ng l e ha l f s i ne - w a ve

s up e r i m p o s e d o n r a t e d l o a d ( J E D E C m e t ho d )

M a xi m um F o r w a r d V o l t a g e a t 5 . 0 A D C

M a xi m um D C R e ve r s e C ur r e nt a t T

= 2 5

R a t e d D C B l o c k i ng Vo l t a g e T

= 1 2 5

M a x i m u m R e v e r s e R e c o v e r y Ti m e

Ty p i c a l J u n c t i o n c a p a c i t a n c e

Ty p i c a l T h e r m a l R e s i s t a n c e

O p e r a t i n g J u n c t i o n a n d S t o r a g e Te m p e r a t u r e R a n g e

S YM B O L E D 5 0 2 YT E D 5 0 3 YT E D 5 0 4 YT E D 5 0 6 YT

RRM

RMS

D C

F ( A V )

F S M

J A

, T

S T G

0 .9 5

200

140

200

300

210

300

5 .0

1 .2 5

1 .0

300

9 .0

-5 5 to +1 5 0

U N IT S

400

280

400

600

420

600

1 .7 0

C / W

NOTES:

1. Thermal Resistance Junction to Ambient .

STAD-MAR.06.2009

PAGE . 1

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