D32F407IGH6 datasheet, PDF - EEWORLD Datasheet

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D32F407IGH6: Description168,1024K,192K,up to 140,2,8,2,2,2,1,3,3,FS+HS,2,3(24),2,BGA176; CategoryThe embedded processor and controller; File Size1MB，69 Pages; ManufacturerGigaDevice; Websitehttp://www.gigadevice.com; Founded in Silicon Valley in 2005, GigaDevice is a leading fabless semiconductor company dedicated to providing advanced storage technologies and IC solutions. The company successfully completed its IPO on the Shanghai Stock Exchange in 2016. GigaDevice offers a wide range of high-performance flash memory and 32-bit general-purpose MCU products. It is one of the pioneers of SPI NOR flash memory and currently ranks third in the world in this market segment, with more than 1 billion units shipped annually.

Since 2007, GigaDevice has filed more than 600 patent applications and obtained more than 200 patents. More than 55% of employees are engaged in research and development, which is the basis for continuously differentiating its products from competitors in the market. The GigaDevice management team has absorbed the leading semiconductor industry experience of well-known storage companies in Silicon Valley, South Korea and Taiwan. GigaDevice has passed ISO9001 and ISO14001 certifications from DQS.

GigaDevice currently produces SPI NOR Flash, SPI NAND Flash, and MCUs for embedded, consumer, and mobile communications applications. Its manufacturing model is based on strong relationships with foundry, assembly, and test subcontractor partners. GigaDevice believes that this clearly defined fabless manufacturing model offers a competitive advantage over traditional manufacturing-based integrated device manufacturers because capital equipment expenditures to maintain advanced memory process technologies exceed market returns in many IC memory market sectors. GigaDevice's foundry partners' continued investment in advanced equipment and their rapid growth in 12" wafer capacity are key factors in its success over competitors.

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D32F407IGH6 Overview

168,1024K,192K,up to 140,2,8,2,2,2,1,3,3,FS+HS,2,3(24),2,BGA176

D32F407IGH6 Parametric

Parameter Name	Attribute value
Parts packaging code	BGA176
Reach Compliance Code	unknown
Max Speed (MHz)	168
Memory (Bytes) Flash	1024K
Memory (Bytes) SRAM	192K
I/O	up to 140
Timer GPTM (32bit)	2
Timer GPTM (16bit)	8
Timer Advanced TM (16bit)	2
Timer Basic TM (16bit)	2
Timer SysTick (24bit)
Timer WDG	2
Timer RTC	1
Connectivity USART
Connectivity I2C	3
Connectivity SPI	3
Connectivity USB 2 FS	FS+HS
Connectivity I2S	2
Connectivity Comp
Connectivity OP-AMP
Analog Interface 12bit ADC Units (CHs)	3(24)
Analog Interface 12bit DAC Units	2
Package	BGA176

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GD32F407xx

GigaDevice Semiconductor Inc.

GD32F407xx

ARM

Cortex

-M4 32-bit MCU

Datasheet

GD32F407xx

Table of Contents

List of Figures

............................................................................................................................. 3

List of Tables

............................................................................................................................... 4

2.1

2.2

2.3

2.4

2.5

2.6

Introduction

...................................................................................................................... 6

Device overview

............................................................................................................... 7

Device information

.............................................................................................................................. 7

Block diagram

...................................................................................................................................... 9

Pinouts and pin assignment

............................................................................................................ 10

Memory map

...................................................................................................................................... 15

Clock tree

........................................................................................................................................... 18

Pin definitions

.................................................................................................................................... 19

3.1

3.2

3.3

3.4

3.5

3.6

3.7

3.8

3.9

3.10

3.11

3.12

3.13

3.14

3.15

3.16

3.17

3.18

3.19

3.20

3.21

3.22

3.23

3.24

Functional description

.................................................................................................. 40

ARM

Cortex

-M4 core

.................................................................................................................... 40

On-chip memory

................................................................................................................................ 40

Clock, reset and supply management

........................................................................................... 41

Boot modes

........................................................................................................................................ 42

Power saving modes

........................................................................................................................ 42

Analog to digital converter (ADC)

................................................................................................... 43

Digital to analog converter (DAC)

................................................................................................... 43

DMA

.................................................................................................................................................... 44

General-purpose inputs/outputs (GPIOs)

...................................................................................... 44

Timers and PWM generation

........................................................................................................... 45

Real time clock (RTC) and backup registers

................................................................................ 46

Inter-integrated circuit (I2C)

............................................................................................................. 46

Serial peripheral interface (SPI)

...................................................................................................... 47

Universal synchronous/asynchronous receiver transmitter (USART/UART)

........................... 47

Inter-IC sound (I2S)

.......................................................................................................................... 47

Universal serial bus on-the-go full-speed (USB OTG FS)

.......................................................... 48

Universal serial bus on-the-go high-speed (USB OTG HS)

....................................................... 48

Controller area network (CAN)

........................................................................................................ 48

Ethernet MAC interface

.................................................................................................................... 49

External memory controller (EXMC)

.............................................................................................. 49

Secure digital input and output card interface (SDIO)

................................................................. 49

Digital camera interface (DCI)

......................................................................................................... 50

Debug mode

...................................................................................................................................... 50

Package and operation temperature

.............................................................................................. 50

4.1

4.2

Electrical characteristics

.............................................................................................. 51

Absolute maximum ratings

.............................................................................................................. 51

Recommended DC characteristics

................................................................................................. 51

GD32F407xx

4.3

4.4

4.5

4.6

4.7

4.8

4.9

4.10

4.11

4.12

4.13

4.14

4.15

4.16

Power consumption

.......................................................................................................................... 52

EMC characteristics

.......................................................................................................................... 53

Power supply supervisor characteristics

....................................................................................... 54

Electrical sensitivity...........................................................................................................................

External clock characteristics

.......................................................................................................... 55

Internal clock characteristics

........................................................................................................... 56

PLL characteristics

........................................................................................................................... 57

Memory characteristics

.................................................................................................................... 58

GPIO characteristics

......................................................................................................................... 59

ADC characteristics

.......................................................................................................................... 60

DAC characteristics

.......................................................................................................................... 62

SPI characteristics

............................................................................................................................ 63

I2C characteristics

............................................................................................................................ 63

USART characteristics

..................................................................................................................... 63

5.1

5.2

Package information

..................................................................................................... 64

LQFP package outline dimensions

................................................................................................ 64

BGA package outline dimensions

.................................................................................................. 66

Ordering information

..................................................................................................... 67

Revision history

............................................................................................................. 68

GD32F407xx

List of Tables

Table 1. GD32F407xx devices features and peripheral list...................................................................................

Table 2. GD32F407xx pin definitions

...................................................................................................................... 19

Table 3. Port A alternate functions summary

......................................................................................................... 31

Table 4. Port B alternate functions summary

......................................................................................................... 32

Table 5. Port C alternate functions summary

......................................................................................................... 33

Table 6. Port D alternate functions summary

......................................................................................................... 34

Table 7. Port E alternate functions summary

......................................................................................................... 35

Table 8. Port F alternate functions summary

......................................................................................................... 36

Table 9. Port G alternate functions summary

........................................................................................................ 37

Table 10. Port H alternate functions summary

...................................................................................................... 38

Table 11. Port I alternate functions summary

........................................................................................................ 39

Table 12. Absolute maximum ratings

...................................................................................................................... 51

Table 13. DC operating conditions

.......................................................................................................................... 51

Table 14. Power consumption characteristics

....................................................................................................... 52

Table 15. EMS characteristics

................................................................................................................................. 53

Table 16. EMI characteristics

................................................................................................................................... 53

Table 17. Power supply supervisor characteristics

.............................................................................................. 54

Table 18. ESD characteristics..................................................................................................................................

Table 19. Static latch-up characteristics

................................................................................................................ 54

Table 20. High speed external clock (HXTAL) generated from a crystal/ceramic characteristics

................. 55

Table 21. Low speed external clock (LXTAL) generated from a crystal/ceramic characteristics

................... 55

Table 22. High speed internal clock (IRC16M) characteristics

........................................................................... 56

Table 23. High speed internal clock (IRC48M) characteristics

........................................................................... 56

Table 24. Low speed internal clock (IRC32K) characteristics

............................................................................. 57

Table 25. PLL characteristics

................................................................................................................................... 57

Table 26. PLL spread spectrum clock generation (SSCG) characteristics

....................................................... 57

Table 27. Flash memory characteristics

................................................................................................................. 58

Table 28. I/O port characteristics

............................................................................................................................. 59

Table 29. ADC characteristics

.................................................................................................................................. 60

Table 30. ADC R

AIN max

for f

ADC

=40MHz

................................................................................................................. 60

Table 31. ADC dynamic accuracy at f

ADC

= 30 MHz

............................................................................................. 61

Table 32. ADC dynamic accuracy at f

ADC

= 30 MHz

............................................................................................. 61

Table 33. ADC dynamic accuracy at f

ADC

= 36 MHz

............................................................................................. 61

Table 34. ADC dynamic accuracy at f

ADC

= 40 MHz

............................................................................................. 61

Table 35. ADC static accuracy at f

ADC

= 15 MHz

.................................................................................................. 61

Table 36. DAC characteristics

................................................................................................................................. 62

Table 37. SPI characteristics

.................................................................................................................................... 63

Table 38. I2C characteristics

.................................................................................................................................... 63

Table 39. USART characteristics

............................................................................................................................ 63

Table 40. LQFP package dimensions

..................................................................................................................... 65

Table 41. BGA package dimensions

....................................................................................................................... 66

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