CJP1117-1.5 datasheet, PDF - EEWORLD Datasheet

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CJP1117-1.5: DescriptionRegulator; CategoryPower/power management The power supply circuit; File Size213KB，11 Pages; ManufacturerJCET; Websitehttp://www.cj-elec.com/; Jiangsu Changdian Technology Co., Ltd. focuses on semiconductor packaging and testing business, providing customers at home and abroad with a full range of solutions such as chip testing, packaging design, packaging testing, etc. The company was successfully listed on the Shanghai Main Board in 2003, becoming the first semiconductor packaging and testing listed company in China. It now has a national enterprise technology center and a postdoctoral research workstation. It is a national key high-tech enterprise, a supporting unit of the National Engineering Laboratory for High-density Integrated Circuits, and the chairman unit of the Integrated Circuit Packaging Technology Innovation Strategic Alliance.

Discrete devices: diodes (switching diodes, Schottky diodes (Schottky rectifiers), voltage regulator diodes, Pin diodes, TVS diodes, rectifier diodes, fast recovery diodes); transistors (Darlington tubes, digital transistors, MOSFETs); thyristors: silicon-controlled rectifiers, triacs; composite tubes: transistors + field-effect tubes, dual transistors, dual digital transistors, digital transistors + transistors, transistors + diodes, field-effect tubes + diodes, dual field-effect tubes. Voltage regulator circuit; energy-saving lamp charger switch tube

Lead frame: TO series (TO); SOD series (SOD); SOT series (TSOT, SOT); FBP series (WBFBP); QFN series (QFNWB, DFNWB, DFNFC, QFNFC); QFP series (LQFP: PQFP: PLCC: TQFP); SIP series (SIP, HSIP, FSIP); SOP series (SOP, HSOP, SSOP, MSOP, HTSOP, TSSOP); DIP series (DIP, FDIP, SDIP); PDFN series; PQFN series; MIS series (MISFC, MISWB)

Nine core technologies: Through Silicon Via (TSV) packaging technology; SiP RF packaging technology; wafer-level 3D rewiring packaging process technology; copper bump interconnection technology; high-density FC-BGA packaging and testing technology (Flip Chip BGA); multi-turn array four-sided pinless packaging and testing technology; package body 3D stacking technology; 50μm or less ultra-thin chip 3D stacking packaging technology; MEMS multi-chip packaging technology; MIS packaging technology (pre-encapsulated interconnection system); BGA packaging technology, etc.

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Regulator

CJP1117-1.5 Parametric

Parameter Name	Attribute value
package instruction	,
Reach Compliance Code	unknown
Base Number Matches	1

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JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD

1A LOW DROPOUT LINEAR REGULATOR

GENERAL DESCRIPTION

The CJ1117 is a series of low dropout three-terminal regulators with a dropout of 1.15V at 1A output current.

The CJ1117 series provides current limiting and thermal shutdown. Its circuit includes a trimmed bandgap

reference to assure output voltage accuracy to be within 1%. Current limit is trimmed to ensure specified output

Current and controlled short-circuit current. On-chip thermal shutdown provides protection against any

combination of overload and ambient temperature that would create excessive junction temperature.

The CJ1117 has an adjustable version, that can provide the output voltage from 1.25V to 12V with only 2

external resistors.

The CJ1117 series is available in the industry standard SOT-223,SOT-89,TO-220,TO-252 and TO-263 power

packages.

FEATURES

•

Low Dropout Voltage: 1.15V at 1A Output Current

•

Trimmed Current Limit

•

On-Chip Thermal Shutdown

•

Three-Terminal Adjustable or Fixed 1.5V, 1.8V, 2.5V, 3.3V, 5V

•

Operation junction Temperature: 0

℃

to125℃

APPLICATIONS

•

PC Motherboard

•

LCD Monitor

•

Graphic Card

•

DVD-Video player

•

NIC/Switch

•

Telecom Modem

•

ADSL Modem

•

Printer and other peripheral Equipment

TO-251

Figure 1. Package Types of CJ1117

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