BZX84C9V1W datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Discrete semiconductor> BZX84C9V1W

Preview

BZX84C9V1W: DescriptionZener diode; CategoryDiscrete semiconductor; File Size4MB，2 Pages; ManufacturerJCET; Websitehttp://www.cj-elec.com/; Jiangsu Changdian Technology Co., Ltd. focuses on semiconductor packaging and testing business, providing customers at home and abroad with a full range of solutions such as chip testing, packaging design, packaging testing, etc. The company was successfully listed on the Shanghai Main Board in 2003, becoming the first semiconductor packaging and testing listed company in China. It now has a national enterprise technology center and a postdoctoral research workstation. It is a national key high-tech enterprise, a supporting unit of the National Engineering Laboratory for High-density Integrated Circuits, and the chairman unit of the Integrated Circuit Packaging Technology Innovation Strategic Alliance.

Discrete devices: diodes (switching diodes, Schottky diodes (Schottky rectifiers), voltage regulator diodes, Pin diodes, TVS diodes, rectifier diodes, fast recovery diodes); transistors (Darlington tubes, digital transistors, MOSFETs); thyristors: silicon-controlled rectifiers, triacs; composite tubes: transistors + field-effect tubes, dual transistors, dual digital transistors, digital transistors + transistors, transistors + diodes, field-effect tubes + diodes, dual field-effect tubes. Voltage regulator circuit; energy-saving lamp charger switch tube

Lead frame: TO series (TO); SOD series (SOD); SOT series (TSOT, SOT); FBP series (WBFBP); QFN series (QFNWB, DFNWB, DFNFC, QFNFC); QFP series (LQFP: PQFP: PLCC: TQFP); SIP series (SIP, HSIP, FSIP); SOP series (SOP, HSOP, SSOP, MSOP, HTSOP, TSSOP); DIP series (DIP, FDIP, SDIP); PDFN series; PQFN series; MIS series (MISFC, MISWB)

Nine core technologies: Through Silicon Via (TSV) packaging technology; SiP RF packaging technology; wafer-level 3D rewiring packaging process technology; copper bump interconnection technology; high-density FC-BGA packaging and testing technology (Flip Chip BGA); multi-turn array four-sided pinless packaging and testing technology; package body 3D stacking technology; 50μm or less ultra-thin chip 3D stacking packaging technology; MEMS multi-chip packaging technology; MIS packaging technology (pre-encapsulated interconnection system); BGA packaging technology, etc.

Download Datasheet View All

BZX84C9V1W Overview

Zener diode

Features

Product Name: Zener Diode

Product model: BZX84C9V1W

product features:

Planar Die Construction

200mW Power Dissipation

Zener Voltages from 2.4V - 39V

Ultra-Small Surface Mount Package Power dissipation

Product parameters:

Pd power dissipation: 200mW

Vz stable voltage: Nom=9.1V Min=8.5V Max=9.6V

Zzt breakdown impedance: 15Ω

Zzk breakdown impedance: 80Ω

IR reverse current: 0.5uA

Vf forward voltage drop: 0.9V

Package: SOT-323

BZX84C9V1W Preview

Download Datasheet

View All

JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD

SOT-323 Plastic-Encapsulate DIODE

BZX84C2V4W-BZX84C39W

ZENER

DIODE

SOT-323

FEATURES

Planar Die Construction

200mW Power Dissipation

Zener Voltages from 2.4V - 39V

Ultra-Small Surface Mount Package Power dissipation

Maximum Ratings(T

=25℃ unless otherwise specified)

Characteristic

Forward Voltage (Note 2)

Power Dissipation(Note 1)

Thermal Resistance, Junction to Ambient Air

Operating and Storage Temperature Range

@ I

= 10mA

Symbol

θJA

STG

Value

0.9

200

625

-65~ +150

Unit

℃

/ W

℃

A,Jun,2011

Recommended Resources

two-tone generator

Motor low speed and high torque control circuit

Bole brand BCD-185, BCD-205 refrigerator circuit

Voice controlled lighting circuit.gif

Oscillator with separately controlled LED on and off times

intermittent operation circuit

The mobile station adds a new board, the STM32F723 Discovery Kit: [align=left][font=微软雅黑][size=4][b]The development board mobile station has added a new board: the STM32F723 Discovery Kit. First, a brief introduction to the board: [/b][/size][/font][/align] [align=l...; 高进 stm32/stm8

[Teardown of the car wireless charger] - Disassembling the Deli wireless car charger: [i=s]This post was last edited by Beifang on 2022-9-13 22:19[/i]EEWorld invites you to disassemble (sixth issue): disassemble the car wireless charger - Power Technology - Electronic Engineering World...; 北方 Switching Power Supply Study Group

TTP250-S001 dimming solution and capacitive touch switch chip: TTP250-S001 dimming solution and capacitive touch switch chip product description : Tongtai TTP250-S001 is a touch chip for LED light brightness adjustment. This chip can select stepless dimming or fo...; 卓联微科技 ADI Reference Circuit

[Fudan Micro FM33LG0 Series Development Board Review] A Preliminary Study on the Rubik's Cube Development Environment: [i=s]This post was last edited by Beifang on 2021-11-22 14:04[/i][index][#][#][/index] 1. Brief Introduction of Rubik's Cube Development Environment First you need to log in to the developer website a...; 北方 Domestic Chip Exchange

BOOST Circuit Simulation: I have done a simulation of a BOOST circuit.Why is it that when the circuit starts working, the inductor current is in continuous mode, but becomes discontinuous mode after a period of time?...; sfcsdc Power technology

Bluetooth (cc2540) protocol stack learning 1: app ---------------------------------------------------------- Gap role profile application battery profile ...---------------------------------------------------------- Host -------------------------...; Jacktang Wireless Connectivity

Popular Components