BZX84C3V3_R1_00001 datasheet, PDF

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BZX84C3V3_R1_00001: DescriptionAccuracy: - Regulated voltage value (typ.): 3.3V Reverse leakage current: 5uA @ 1V Maximum power: 410mW; CategoryDiscrete semiconductor diode; File Size128KB，6 Pages; ManufacturerPANJIT; Websitehttp://www.panjit.com.tw/; Environmental Compliance; PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.

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BZX84C3V3_R1_00001 Overview

Accuracy: - Regulated voltage value (typ.): 3.3V Reverse leakage current: 5uA @ 1V Maximum power: 410mW

BZX84C3V3_R1_00001 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	PANJIT
package instruction	R-PDSO-G3
Reach Compliance Code	compliant
ECCN code	EAR99
Configuration	SINGLE
Diode component materials	SILICON
Diode type	ZENER DIODE
Maximum dynamic impedance	95 Ω
JESD-30 code	R-PDSO-G3
JESD-609 code	e3
Number of components	1
Number of terminals	3
Maximum operating temperature	150 °C
Minimum operating temperature	-55 °C
Package body material	PLASTIC/EPOXY
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
polarity	UNIDIRECTIONAL
Maximum power dissipation	0.41 W
Nominal reference voltage	3.3 V
surface mount	YES
technology	ZENER
Terminal surface	Matte Tin (Sn)
Terminal form	GULL WING
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
Maximum voltage tolerance	4.99%
Working test current	5 mA

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BZX84C2V4 SERIES

SURFACE MOUNT SILICON ZENER DIODES

VOLTAGE

2.4 to 75 Volt

POWER

410 mWatt

0.006(0.15)MIN.

0.008(0.20)

0.003(0.08)

0.044(1.10)

0.035(0.90)

0.020(0.50)

0.013(0.35)

FEATURES

• Planar Die construction

• 410mW Power Dissipation

• Zener Voltages from 2.4~75V

• Ideally Suited for Automated Assembly Processes

• Lead free in compliance with EU RoHS 2011/65/EU directive

• Green molding compound as per IEC61249 Std. . (Halogen Free)

0.056(1.40)

0.047(1.20)

0.120(3.04)

0.110(2.80)

0.079(2.00)

0.070(1.80)

MECHANICAL DATA

0.004(0.10)

• Case: SOT-23, Molded Plastic

• Terminals: Solderable per MIL-STD-750, Method 2026

• Approx. Weight: 0.0003 ounces, 0.0084 grams

0.000(0.00)

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS(T

=25 C unless otherwise noted)

Parameter

Maximum Power Dissipation (Notes 1) at 25

Typical Thermal Resistance ,Junction to Ambient (Notes 2)

Operating Junction and StorageTemperature Range

Symbol

ΘJA

Value

410

500

-55 to +150

Units

C/W

NOTES:

1. Mounted on 50mmX16mm FR-4 board.

2. Mounted on minimum pad layout (1cmX1cm FR-4 board).

SINGLE

May 6,2015-REV.04

PAGE . 1

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