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BZX84C39_R1_10001

Description
Zener Diode, 39V V(Z), 5%, 0.41W, Silicon, Unidirectional, ROHS COMPLIANT, PLASTIC PACKAGE-3
CategoryDiscrete semiconductor    diode   
ManufacturerPANJIT
Websitehttp://www.panjit.com.tw/
Environmental Compliance  

PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values ​​include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.

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BZX84C39_R1_10001 Overview

Zener Diode, 39V V(Z), 5%, 0.41W, Silicon, Unidirectional, ROHS COMPLIANT, PLASTIC PACKAGE-3

BZX84C39_R1_10001 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerPANJIT
package instructionR-PDSO-G3
Contacts3
Reach Compliance Codecompliant
ECCN codeEAR99
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
JESD-30 codeR-PDSO-G3
Number of components1
Number of terminals3
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
polarityUNIDIRECTIONAL
Maximum power dissipation0.41 W
Nominal reference voltage39 V
surface mountYES
technologyZENER
Terminal formGULL WING
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
Maximum voltage tolerance5%
Working test current5 mA

BZX84C39_R1_10001 Preview

Download Datasheet
BZX84C2V4 SERIES
SURFACE MOUNT SILICON ZENER DIODES
VOLTAGE
2.4 to 75 V
olt
POWER
410 mWatt
SOT-23
Unit
inch(mm)
• Planar Die construction
• 410mW Power Dissipation
• Zener Voltages from 2.4~75V
• Ideally Suited for Automated Assembly Processes
• Lead free in
compliance with EU RoHS 2011/65/EU directives
• Green molding compound as per IEC61249 Std. . (Halogen Free)
0.056(1.40)
0.047(1.20)
0.120(3.04)
0.110(2.80)
0.006(0.15)MIN.
FEATURES
0.103(2.60)
0.044(1.10)
0.035(0.90)
0.020(0.50)
0.013(0.35)
0.079(2.00)
0.070(1.80)
0.008(0.20)
0.003(0.08)
MECHANICAL DATA
• Case: SOT-23, Molded Plastic
• Terminals: Solderable per MIL-STD-750, Method 2026
• Polarity: See Diagram Below
• Approx. Weight:
0.0003 ounces,
0.0084 grams
• Mounting Position: Any
0.004(0.10)MAX.
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS(T
A
=25 C unless otherwise noted)
o
Parameter
Maximum Power Dissipation (Notes 1) at 25
O
C
Typical Thermal Resistance ,Junction to Ambient (Notes 2)
Operating Junction and StorageTemperature Range
Symbol
P
D
R
ΘJA
T
J
Value
410
500
-55 to +150
Units
mW
O
C/W
O
C
NOTES:
1. Mounted on 50mmX16mm FR-4 board.
2. Mounted on minimum pad layout (1cmX1cm FR-4 board).
SINGLE
3
1
2
June 14,2011-REV.02
PAGE . 1
0.086(2.20)
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