BZX84C30TW_R2_00001 datasheet, PDF

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BZX84C30TW_R2_00001: DescriptionZener Diode,; CategoryDiscrete semiconductor diode; ManufacturerPANJIT; Websitehttp://www.panjit.com.tw/; Environmental Compliance; PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.

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Zener Diode,

BZX84C30TW_R2_00001 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	PANJIT
package instruction	R-PDSO-G6
Reach Compliance Code	compliant
ECCN code	EAR99
Configuration	SEPARATE, 3 ELEMENTS
Diode component materials	SILICON
Diode type	ZENER DIODE
Maximum dynamic impedance	80 Ω
JESD-30 code	R-PDSO-G6
Maximum knee impedance	300 Ω
Number of components	3
Number of terminals	6
Maximum operating temperature	150 °C
Minimum operating temperature	-65 °C
Package body material	PLASTIC/EPOXY
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
polarity	UNIDIRECTIONAL
Maximum power dissipation	0.2 W
Nominal reference voltage	30 V
Maximum reverse current	0.1 µA
Reverse test voltage	21 V
surface mount	YES
technology	ZENER
Terminal form	GULL WING
Terminal location	DUAL
Maximum voltage tolerance	5%
Working test current	5 mA

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BZX84C2V4TW~BZX84C75TW

TRIPLE ISOLATED SURFACE MOUNT ZENER DIODES

VOLTAGE

2.4 to 75 Volts

POWER

200mWatts

FEATURES

• 200mW Power Dissipation Rating

• Zener Voltages from 2.4~75V

• Ideally Suited for Automatic Insertion

•

0.054(1.35)

0.045(1.15)

0.030(0.75)

0.021(0.55)

0.056(1.40)

0.047(1.20)

0.087(2.20)

0.074(1.90)

0.010(0.25)

MECHANICAL DATA

• Case: SOT-363, Molded Plastic

• Terminals: Solderable per MIL-STD-750, Method 2026

• Polarity: See Diagram

• Approx. Weight: 0.0002 ounces, 0.006 grams

• Mounting Position: Any

0.010(0.25)

0.003(0.08)

0.004(0.10)

0.000(0.00)

0.012(0.30)

0.005(0.15)

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

PARAMETER

Power Dissipation (Note 1)

Thermal Resistance, Junction to Ambient Air (Note 1)

Operating Junction Temperature and Storage Temperature Range

SYMBOL

VALUE

200

625

-65 to +150

UNITS

ΘJA

STG

C/W

NOTES:

1. FR-5 Board,minimum pad mounting (see min pad layout on page3).

October 05,2011-REV.01

PAGE . 1

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