BZX84B20 datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Discrete semiconductor> BZX84B20

BZX84B20: DescriptionZener diode; CategoryDiscrete semiconductor; File Size2MB，2 Pages; ManufacturerJCET; Websitehttp://www.cj-elec.com/; Jiangsu Changdian Technology Co., Ltd. focuses on semiconductor packaging and testing business, providing customers at home and abroad with a full range of solutions such as chip testing, packaging design, packaging testing, etc. The company was successfully listed on the Shanghai Main Board in 2003, becoming the first semiconductor packaging and testing listed company in China. It now has a national enterprise technology center and a postdoctoral research workstation. It is a national key high-tech enterprise, a supporting unit of the National Engineering Laboratory for High-density Integrated Circuits, and the chairman unit of the Integrated Circuit Packaging Technology Innovation Strategic Alliance.

Discrete devices: diodes (switching diodes, Schottky diodes (Schottky rectifiers), voltage regulator diodes, Pin diodes, TVS diodes, rectifier diodes, fast recovery diodes); transistors (Darlington tubes, digital transistors, MOSFETs); thyristors: silicon-controlled rectifiers, triacs; composite tubes: transistors + field-effect tubes, dual transistors, dual digital transistors, digital transistors + transistors, transistors + diodes, field-effect tubes + diodes, dual field-effect tubes. Voltage regulator circuit; energy-saving lamp charger switch tube

Lead frame: TO series (TO); SOD series (SOD); SOT series (TSOT, SOT); FBP series (WBFBP); QFN series (QFNWB, DFNWB, DFNFC, QFNFC); QFP series (LQFP: PQFP: PLCC: TQFP); SIP series (SIP, HSIP, FSIP); SOP series (SOP, HSOP, SSOP, MSOP, HTSOP, TSSOP); DIP series (DIP, FDIP, SDIP); PDFN series; PQFN series; MIS series (MISFC, MISWB)

Nine core technologies: Through Silicon Via (TSV) packaging technology; SiP RF packaging technology; wafer-level 3D rewiring packaging process technology; copper bump interconnection technology; high-density FC-BGA packaging and testing technology (Flip Chip BGA); multi-turn array four-sided pinless packaging and testing technology; package body 3D stacking technology; 50μm or less ultra-thin chip 3D stacking packaging technology; MEMS multi-chip packaging technology; MIS packaging technology (pre-encapsulated interconnection system); BGA packaging technology, etc.

View All

BZX84B20 Online Shopping

Suppliers	Part Number	Price	MOQ	In stock
	BZX84B20	-	-	View	Buy Now

BZX84B20 Overview

Zener diode

Features

Product Name: Zener Diode

Product model: BZX84B20

product features:

Planar Die Construction

350mW Power Dissipation

Zener Voltages from 2.4V - 39V

Ultra-Small Surface Mount Package Power dissipation

Product parameters:

Pd power dissipation: 300mW

Vz stable voltage: Nom=20V Min=19.6V Max=20.4

Zzt breakdown impedance: 55Ω

Zzk breakdown impedance: 225Ω

IR reverse current: 0.1uA

Vf forward voltage drop: 0.9V

Package: SOT-23

BZX84B20 Preview

Download Datasheet

View All

JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD

SOT-23 Plastic-Encapsulate D

iodes

BZX84B2V4-BZX84B39

SOT-23

ZENER

DIODES

FEATURES

Planar Die Construction

350mW Power Dissipation

Zener Voltages from 2.4V - 39V

Ultra-Small Surface Mount Package Power dissipation

Maximum Ratings

=25℃ unless otherwise specified

)

Characteristic

Forward Voltage (Note 2)

Power Dissipation(Note 1)

Thermal Resistance, Junction to Ambient Air

Operating and Storage Temperature Range

@ I

= 10mA

Symbol

θJA

STG

Value

0.9

300

417

-65~ +150

Unit

℃

/ W

℃

A,Dec,2011

Recommended Resources

TDA2611A power amplifier circuit diagram

TOPSwitch application circuit in PFC circuit 02

Electronic watering timer circuit

Five-function electronic watch circuit

6OXT(1.0) computer motherboard circuit diagram_11

A collection of seven voltage regulator diode application circuits: [font=宋体][size=4] [/size][/font] [font=宋体][size=5][color=#0000ff][b]1. Analysis of typical DC voltage stabilization circuit with Zener diode [/b][/color][/size][/font] [font=宋体][size=4] Zener diode is...; tiankai001 Analog electronics

Disadvantages of Too Large Bootstrap Capacitor in DC-DC Circuits: As shown in the DC-DC circuit below, the bootstrap capacitor (C3) recommended by the spec is 10nF. The actual circuit is 22uF. Are there any disadvantages (or hazards) in using such a large bootstrap ...; xiaxingxing Analog electronics

What is the idea of selecting a Zener diode? What parameters should be known first? Then, which components should be calculated based on the known quantities...: What is the idea of selecting a Zener diode? What parameters should be known first? And what component parameters should be calculated based on the known quantities?...; QWE4562009 Integrated technical exchanges

Live picture broadcast at 13:00 this afternoon｜2020 STM32 National Seminar Shenzhen Station: On September 13, the STM32 Shenzhen Seminar will discuss the latest technological innovations of STM32 and its applications in IoT security, smart industry and other fields with Die Fans through live ...; EEWORLD社区 ST Sensors & Low Power Wireless Technology Forum

The difference between dsp2812 and dsp28335: [size=4][color=#000000][backcolor=white] The TMS320F28335 digital signal processor is the latest 32-bit floating-point DSP controller launched by TI. Compared with the TMS320F2812 fixed-point DSP, the...; Aguilera DSP and ARM Processors

Design of intelligent window control system based on single chip microcomputer: [p=30, null, left][b] I. Introduction[/b] With the continuous development of electronic technology, many household electrical appliances such as color TVs, refrigerators, air conditioners, etc. have b...; fish001 Microcontroller MCU

Popular Components