PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.
[i=s]This post was last edited by qiujiao on 2019-3-26 20:44[/i] [align=left]I made a stm32f429 board. PF8 is short-circuited to the ground after power is turned on, but it is not disconnected after p...
The ZigBee standard defines a stack protocol that ensures interoperability of wireless devices in low-cost, low-power, and low-data-rate networks. This article briefly describes the ZigBee stack struc...
#include//Contains the header file of the microcontroller register #include//Header file containing _nop_() function definition //ADC0832 port pin definition sbit CS=P3^0; //Define CS bit as P3.4 pin ...
urgent!!!
What kind of sensor can identify aluminum cans? If it detects aluminum, it will automatically identify non-aluminum objects. I would like to ask the experts to answer this question, or is th...
With the development of integrated circuits, wireless communication technology and embedded technology, wireless communication networks have also emerged. Wireless sensor networks have the characteris...
In the past two days, IBM has made a low-key news, launching a brain-inspired chip "NorthPole". Compared with the Nvidia H100 GPU implemented on the 4nm node, NorthPole's energy efficiency has increa...[Details]
Newly developed lenses and multiple options are used to adapt to the power device field, which is expanding in the market trend.
On September 24, 2024, Canon※1 released its new semic...[Details]
Huawei founder Ren Zhengfei accepted an interview with the American financial media CNBC. On June 25, Huawei's Public and Government Affairs Department released the minutes of this interview on the "...[Details]
According to the Taiwan Economic Daily, the Taiwan Science and Technology Administration once again announced on March 13 that the development schedule of TSMC’s 2 nanometer factory will be postponed...[Details]
If software is involved in an M&A transaction, it is critical to identify open source components in the target code base. When M&A transactions are in progress, what is contained in the code is criti...[Details]
According to TrendForce's survey of the impact area of the strong earthquake in the Noto area of Ishikawa Prefecture, Japan, the surrounding areas include MLCC factory TAIYO YUDEN , silicon wafer...[Details]
July 1 news, according to foreign media reports, the United States has previously announced that it will implement new export controls on technologies such as EDA software necessary for designing G...[Details]
According to reports, the latest data shows that the growth rate of global semiconductor sales has slowed down for six consecutive months. This actually sends another signal that the global economy i...[Details]
On November 5, the 3rd China Semiconductor Large Silicon Wafer Forum 2020 was held in Nanjing. Chen Yuenan, senior analyst at Jiwei Consulting, delivered a keynote speech entitled "The Current Situat...[Details]
Accelerating the process development of feature-dependent (FD) dry etching
In dry etching, the trajectories of accelerated ions are non-uniform and non-vertical due to collisions wit...[Details]
In order to prevent China from becoming the global leader in the semiconductor field, the Biden administration announced radical export control measures in October last year. When US President Biden ...[Details]
The epidemic in 2020 exacerbated the capital winter, but investment in the semiconductor industry rose against the market trend. According to statistics, in the first ten months of this year, domesti...[Details]
On May 15, TSMC reconfirmed at the recently held 2024 European Technology Forum that its German wafer factory project is scheduled to start construction in the fourth quarter of this year and is ex...[Details]
On October 28, Intel announced today that it will expand the capacity of its packaging and testing base in Chengdu. This move aims to deepen its service commitment to the Chinese market and acceler...[Details]
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