Yangzhou Yangjie Electronic Technology Co., Ltd. was established on August 2, 2006 with a registered capital of RMB 472 million. In January 2014, the company was listed on the Shenzhen Stock Exchange's Growth Enterprise Market with the stock code 300373. In 2017, the company's operating income was RMB 1.47 billion. The company integrates R&D, production and sales, and is professionally committed to the industrial development of power semiconductor chips and device manufacturing, integrated circuit packaging and testing, etc. The company's main products are various power electronic device chips, power diodes, rectifier bridges, high-power modules, DFN/QFN products, SGT MOS and silicon carbide SBD, silicon carbide JBS, etc. The products are widely used in many fields such as consumer electronics, security, industrial control, automotive electronics, and new energy.
IAR was used as the development platform for MSP430 for a long time. A few days ago, a wireless monitoring project used Zigbee (CC2530), so I started using IAR as the development platform for 8051.
So...
The power of science and technology is everywhere in our lives. Many things we use in our daily lives are produced because of the high level of science and technology, and these products have been wid...
There is a chip shortage now. Are there any domestic chips that can replace this buck-boost chip from Lingte? LTC1517ES5-3.3, SOT-23 package, 2-4.4V can be buck-boosted to 3.3V, so that the capacity o...
[b][color=#5E7384]This content is originally created by EEWORLD forum user [size=3]tiankai001[/size]. If you need to reprint or use it for commercial purposes, you must obtain the author's consent and...
The Raspberry Pi family was recently expanded with the new Raspberry Pi Zero W1 (February 2017), a wireless personal computer that costs just $10. It’s a real treat for hobbyists, makers, tinkerers an...
The memory industry will rebound from the price bottom in 2024. Although the long Lunar New Year holiday affects the supply chain's willingness to pull goods and the global economic recovery is slow,...[Details]
According to CCTV News: According to the Philippine Institute of Volcanology and Seismology, at around 2:10 local time on February 16, a magnitude 6.0 earthquake occurred near Masbate Province in the...[Details]
Global regulators have long scoffed at the merger of Nvidia and ARM. The U.S. Federal Trade Commission (FTC) filed a lawsuit in December 2021 to block the deal, arguing that if Nvidia gains control o...[Details]
Engineers and physicists at University College London have developed a new method that successfully and reliably positions individual atoms in an array for the first time. Its nearly 100% accuracy ...[Details]
US tech giant Intel met with engineering contractors and told them about its decision to postpone plans to build a new semiconductor factory in Israel, Calcalist reported on Monday, citing contractor...[Details]
As early as last year, we reported that Texas Instruments would build a new 12-inch wafer fab in Richardson, Dallas. Recently, their project has finally taken an important step. According to the perm...[Details]
As the size of integrated circuits shrinks, the development of process technology has encountered more and more technical bottlenecks in terms of perforation, lithography, tunneling, and heat dissipa...[Details]
Source: Peking University EDA Research Institute, Peking University Electronic Design Automation Research Institute
Peking University EDA Research Institute was jointly established...[Details]
According to news on November 7, although Samsung has been working with AMD over the past few years to bring ray tracing capabilities to its Exynos chips, recent news has revealed that Samsung seems ...[Details]
On April 25, the US government announced that it would spend 11 billion US dollars (IT Home Note: currently about 79.86 billion RMB) to establish a special research and development center to promot...[Details]
It was learned from the Qichacha website that Huawei recently announced a patent called "A chip package and a method for preparing a chip package", with the application publication number CN1165477...[Details]
Global electrification is accelerating, and the popularity of new energy vehicles at home and abroad is recovering, which may open a long-term growth window for the automotive power semiconductor mar...[Details]
Laser linewidth measurement. Image source: "Nature·Photonics" A team of researchers at Yale University in the United States has developed the first chip-scale titanium-doped sapphire laser, a bre...[Details]
On August 18, Baidu founder, chairman and CEO Robin Li announced at the Baidu World Conference that the second generation of self-developed AI chip, Kunlun Core 2 (also known as "Kunlun 2"), was offi...[Details]
From October 31 to November 1, the Global New Energy Vehicle Cooperation and Development (Shanghai) Forum (GNEV2024•Shanghai) hosted by the China Electric Vehicle 100 was officially held.
Wit...[Details]
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